Inventor
LIU JINMEI
CN5 patents
⚠️ This page may combine multiple inventors who share the name “LIU JINMEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
4 patentsUS10446476B2Oct 15, 2019
Packaged integrated circuit having stacked die and method for therefor
NXP USA INC3 citations70
US11967507B2Apr 23, 2024
Tie bar removal for semiconductor device packaging
NXP USA INC0 citations57
US11222790B2Jan 11, 2022
Tie bar removal for semiconductor device packaging
NXP USA INC1 citations57
US10734327B2Aug 4, 2020
Lead reduction for improved creepage distance
NXP USA INC0 citations34