Inventor
KAMAKURA TSUKASA
JP39 patents
⚠️ This page may combine multiple inventors who share the name “KAMAKURA TSUKASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
21 patentsUS9472391B2Oct 18, 2016
Semiconductor device manufacturing method
HITACHI INT ELECTRIC INC11 citations84
US9349586B2May 24, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC8 citations84
US9190298B2Nov 17, 2015
Film forming method and recording medium for performing the method
HITACHI INT ELECTRIC INC5 citations84
US9028648B1May 12, 2015
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC9 citations84
US10211110B1Feb 19, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC13 citations83
US10655218B2May 19, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
HITACHI INT ELECTRIC INC4 citations73
US10121650B1Nov 6, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC4 citations73
US9732421B2Aug 15, 2017
Substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations73
US9455137B2Sep 27, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC3 citations73
US9953830B2Apr 24, 2018
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC2 citations71
US9916976B2Mar 13, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations71
US10784116B2Sep 22, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations69
US8946092B2Feb 3, 2015
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
HITACHI INT ELECTRIC INC2 citations63
US10671056B2Jun 2, 2020
Substrate processing system
HITACHI INT ELECTRIC INC1 citations62
US10388512B2Aug 20, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations62
US9831082B2Nov 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC1 citations52
US9673043B2Jun 6, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording medium
HITACHI INT ELECTRIC INC1 citations52
US9520282B2Dec 13, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC1 citations52
US9449813B2Sep 20, 2016
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC1 citations52
US9831083B2Nov 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC0 citations50
US9640387B2May 2, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations42
KOKUSAI ELECTRIC CORP
15 patentsUS11967534B2Apr 23, 2024
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations75
US11251039B2Feb 15, 2022
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP2 citations73
US10808318B2Oct 20, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP3 citations73
US11848201B2Dec 19, 2023
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP0 citations62
US11726456B2Aug 15, 2023
Substrate processing system
KOKUSAI ELECTRIC CORP0 citations62
US11251038B2Feb 15, 2022
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP0 citations62
US10978310B2Apr 13, 2021
Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperature
KOKUSAI ELECTRIC CORP0 citations62
US12540388B2Feb 3, 2026
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12053805B2Aug 6, 2024
Method of cleaning member in process container, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12249503B2Mar 11, 2025
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11810781B2Nov 7, 2023
Method of processing substrate, substrate processing apparatus, recording medium, method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations60
US11728162B2Aug 15, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US12217959B2Feb 4, 2025
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US10847392B2Nov 24, 2020
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations52
US10714316B2Jul 14, 2020
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations41
HIROSE YOSHIRO
2 patentsUS8546272B2Oct 1, 2013
Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
HIROSE YOSHIRO6 citations83
US9378943B2Jun 28, 2016
Method of manufacturing semiconductor device, method of processing substrate substrate processing apparatus and non-transitory computer-readable recording medium
HIROSE YOSHIRO1 citations51