Inventor
NODA TAKAAKI
JP51 patents
⚠️ This page may combine multiple inventors who share the name “NODA TAKAAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
23 patentsUS6686281B2Feb 3, 2004
Method for fabricating a semiconductor device and a substrate processing apparatus
HITACHI INT ELECTRIC INC383 citations99
US9865451B2Jan 9, 2018
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC8 citations84
US9472391B2Oct 18, 2016
Semiconductor device manufacturing method
HITACHI INT ELECTRIC INC11 citations84
US9349586B2May 24, 2016
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC8 citations84
USD748578SFeb 2, 2016
Adapter plate
HITACHI INT ELECTRIC INC7 citations84
US6872636B2Mar 29, 2005
Method for fabricating a semiconductor device
HITACHI INT ELECTRIC INC13 citations83
US10032626B2Jul 24, 2018
Method of manufacturing semiconductor device by forming a film on a substrate, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC9 citations82
US7556839B2Jul 7, 2009
Method of manufacturing semiconductor device and apparatus for processing substrate
HITACHI INT ELECTRIC INC6 citations74
US9793107B2Oct 17, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations73
US9698007B2Jul 4, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
US9653326B2May 16, 2017
Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC3 citations73
USD748056SJan 26, 2016
Adapter plate
HITACHI INT ELECTRIC INC3 citations73
US6905963B2Jun 14, 2005
Fabrication of B-doped silicon film by LPCVD method using BCI3 and SiH4 gases
HITACHI INT ELECTRIC INC9 citations67
US9263251B2Feb 16, 2016
Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC1 citations62
US12040179B2Jul 16, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations60
US9831082B2Nov 28, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC1 citations52
US9673043B2Jun 6, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording medium
HITACHI INT ELECTRIC INC1 citations52
US9514935B2Dec 6, 2016
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and program
HITACHI INT ELECTRIC INC0 citations52
US9153430B2Oct 6, 2015
Substrate processing apparatus, method of manufacturing semiconductor device and program
HITACHI INT ELECTRIC INC0 citations52
US7892983B2Feb 22, 2011
Substrate processing apparatus and producing method of semiconductor device
HITACHI INT ELECTRIC INC1 citations52
US9123531B2Sep 1, 2015
Method of manufacturing semiconductor device, semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC0 citations51
US10062562B2Aug 28, 2018
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC1 citations49
US9530641B2Dec 27, 2016
Method for manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations42
KOKUSAI ELECTRIC CORP
7 patentsUS11251039B2Feb 15, 2022
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP2 citations73
US11848201B2Dec 19, 2023
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP0 citations62
US11251038B2Feb 15, 2022
Method of manufacturing semiconductor device, recording medium, and substrate processing method
KOKUSAI ELECTRIC CORP0 citations62
US12550640B2Feb 10, 2026
Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11972934B2Apr 30, 2024
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12139787B2Nov 12, 2024
Apparatus and method for cleaning reaction vessel for processing substrate
KOKUSAI ELECTRIC CORP0 citations51
US12148611B2Nov 19, 2024
Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations50
HITACHI LTD
5 patentsUS4994688AFeb 19, 1991
Semiconductor device having a reference voltage generating circuit
HITACHI LTD105 citations96
US5285168AFeb 8, 1994
Operational amplifier for stably driving a low impedance load of low power consumption
HITACHI LTD73 citations95
US5376839ADec 27, 1994
Large scale integrated circuit having low internal operating voltage
HITACHI LTD38 citations92
US5254880AOct 19, 1993
Large scale integrated circuit having low internal operating voltage
HITACHI LTD14 citations72
US5539771AJul 23, 1996
Communication line driver, LSI for interface including such a circuit and communication terminal apparatus
HITACHI LTD14 citations67
DAIDO STEEL CO LTD
3 patentsUS4479535AOct 30, 1984
Recuperative radiant tube
DAIDO STEEL CO LTD27 citations89
US4152572AMay 1, 1979
Method of applying electrodes to high temperature heating elements for use in resistance furnaces
DAIDO STEEL CO LTD12 citations66
US4444554AApr 24, 1984
Heating method and apparatus
DAIDO STEEL CO LTD3 citations60
NODA TAKAAKI
3 patentsUS8227030B2Jul 24, 2012
Method of manufacturing semiconductor device and apparatus for processing substrate
NODA TAKAAKI2 citations61
US8221835B2Jul 17, 2012
Method of manufacturing semiconductor device and apparatus for processing substrate
NODA TAKAAKI2 citations61
US8178428B2May 15, 2012
Manufacturing method of semiconductor device and substrate processing apparatus
NODA TAKAAKI4 citations60
DAIKIN IND LTD
2 patentsHITACHI VLSI ENG
1 patentSUMITOMO HEAVY INDUSTRIES
1 patentOZAKI TAKASHI
1 patentYAMAMOTO SATORU
1 patentMIZUNO NORIKAZU
1 patentISUZU MOTORS LTD
1 patentISHIBASHI KIYOHISA
1 patentShowing the top 50 of 51 patents by PatentIndex Score.