Inventor
SAIMEN MUNEHIDE
JP26 patents
⚠️ This page may combine multiple inventors who share the name “SAIMEN MUNEHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
22 patentsUS8016181B2Sep 13, 2011
Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device
SEIKO EPSON CORP7 citations83
US9770907B2Sep 26, 2017
MEMS device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP3 citations73
US7535108B2May 19, 2009
Electronic component including reinforcing member
SEIKO EPSON CORP4 citations62
US7390733B2Jun 24, 2008
Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode
SEIKO EPSON CORP2 citations62
US7316939B2Jan 8, 2008
Semiconductor device manufacturing method and manufacturing apparatus
SEIKO EPSON CORP2 citations62
US7190065B2Mar 13, 2007
Circuit substrate, semiconductor module and method of manufacturing circuit substrate
SEIKO EPSON CORP3 citations62
US7656026B2Feb 2, 2010
Semiconductor device
SEIKO EPSON CORP3 citations53
US10377134B2Aug 13, 2019
MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
SEIKO EPSON CORP0 citations52
US10029459B2Jul 24, 2018
Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP0 citations52
US9969162B2May 15, 2018
MEMS device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP1 citations52
US9914301B2Mar 13, 2018
Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP1 citations52
US9908331B2Mar 6, 2018
MEMS device and liquid ejecting head
SEIKO EPSON CORP0 citations52
US9844939B2Dec 19, 2017
Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP0 citations52
US9684197B2Jun 20, 2017
Electro-optic device and electronic apparatus
SEIKO EPSON CORP0 citations51
US7704793B2Apr 27, 2010
Electronic part and method for manufacturing the same
SEIKO EPSON CORP0 citations51
US7582955B2Sep 1, 2009
Semiconductor device manufacturing method and manufacturing apparatus
SEIKO EPSON CORP0 citations51
US7385142B2Jun 10, 2008
Manufacturing method of electronic part and wiring substrate
SEIKO EPSON CORP0 citations51
US7348679B2Mar 25, 2008
Electronic part having reinforcing member
SEIKO EPSON CORP0 citations51
US7323365B2Jan 29, 2008
Semiconductor device manufacturing method and manufacturing apparatus
SEIKO EPSON CORP0 citations51
US7282389B2Oct 16, 2007
Semiconductor device manufacturing method and manufacturing apparatus
SEIKO EPSON CORP0 citations51
US9919523B2Mar 20, 2018
Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus
SEIKO EPSON CORP0 citations42
US7901528B2Mar 8, 2011
Method for manufacturing wiring substrate having sheet
SEIKO EPSON CORP0 citations41
SAIMEN MUNEHIDE
4 patentsUS8289492B2Oct 16, 2012
Electro-optical device and electronic apparatus
SAIMEN MUNEHIDE6 citations71
US8391020B2Mar 5, 2013
Electro-optical device, electro-optical panel, and electronic apparatus
SAIMEN MUNEHIDE3 citations60
US8675372B2Mar 18, 2014
Electrooptic substrate, electrooptic device, and electronic apparatus
SAIMEN MUNEHIDE1 citations50
US8640582B2Feb 4, 2014
Method for manufacturing flexible substrate and flexible substrate punching device
SAIMEN MUNEHIDE0 citations39