Inventor

LEE SHEN-NAN

TW55 patents

⚠️ This page may combine multiple inventors who share the name “LEE SHEN-NAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE SHEN-NAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Barc-assisted process for planar recessing or removing of variable-height layers

Method for forming multi-layer mask

Method of forming contact plugs for semiconductor device

Systems and methods for performing chemical mechanical planarization

CMP polishing head design for improving removal rate uniformity

Slurry compositions for chemical mechanical planarization

Chemical mechanical polishing slurry composition and method of polishing metal layer

CMP polishing head design for improving removal rate uniformity

Method for conditioning polishing pad

Chemical mechanical polishing slurry composition and method of polishing metal layer

Contact plugs for semiconductor device and method of forming same

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Slurry compositions for chemical mechanical planarization

Method for manufacturing a semiconductor using slurry

Chemical mechanical polishing slurry composition and method of polishing metal layer

Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof

Contact plugs for semiconductor device

Semiconductor structure with oxidized ruthenium

Slurry

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

Method for conditioning polishing pad

CMP slurry solution for hardened fluid material

Method for manufacturing a FinFET device

CMP-friendly coatings for planar recessing or removing of variable-height layers

Mechanism for manufacturing semiconductor device

Materials and methods for chemical mechanical polishing of ruthenium-containing materials

Method for manufacturing a FinFET device

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

CMP-friendly coatings for planar recessing or removing of variable-height layers

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

Fabrication of a polishing pad for chemical mechanical polishing

CMP polishing head design for improving removal rate uniformity

Fabrication of a polishing pad for chemical mechanical polishing

Mechanism for manufacturing semiconductor device

Method for forming multi-layer mask

Method of manufacturing semiconductor device

BARC-assisted process for planar recessing or removing of variable-height layers

Wafer polishing with separated chemical reaction and mechanical polishing

Ruthenium-containing semiconductor structure and method of manufacturing the same

CMP slurry solution for hardened fluid material

TAIWAN SEMICONDUCTOR MFG

Adhesion enhancement between CVD dielectric and spin-on low-k silicate films

Bimodal slurry system

Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance

Method to reduce dishing and erosion in a CMP process

LEE SHEN-NAN

High planarizing method for use in a gate last process

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

Chemical mechanical polish process control for improvement in within-wafer thickness uniformity

IND TECH RES INST

Method of wastewater treatment by electrolysis and oxidization