Inventor
WEN YENTING
US15 patents
⚠️ This page may combine multiple inventors who share the name “WEN YENTING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
8 patentsUS10573803B1Feb 25, 2020
Current sensor packages with through hole in semiconductor
SEMICONDUCTOR COMPONENTS IND LLC8 citations84
US9679878B1Jun 13, 2017
Embedded stacked die packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC9 citations83
US9941257B2Apr 10, 2018
Embedded stacked die packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations72
US11417598B2Aug 16, 2022
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10811598B2Oct 20, 2020
Current sensor packages
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US10651124B2May 12, 2020
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US10396028B2Aug 27, 2019
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US9984968B2May 29, 2018
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
SEMICONDUCTOR COMPONENTS IND
5 patentsUS7227240B2Jun 5, 2007
Semiconductor device with wire bond inductor and method
SEMICONDUCTOR COMPONENTS IND57 citations93
US7589392B2Sep 15, 2009
Filter having integrated floating capacitor and transient voltage suppression structure and method of manufacture
SEMICONDUCTOR COMPONENTS IND16 citations79
US7579670B2Aug 25, 2009
Integrated filter having ground plane structure
SEMICONDUCTOR COMPONENTS IND5 citations62
US7466212B2Dec 16, 2008
Semiconductor filter structure and method of manufacture
SEMICONDUCTOR COMPONENTS IND2 citations57
US9373600B2Jun 21, 2016
Package substrate structure for enhanced signal transmission and method
SEMICONDUCTOR COMPONENTS IND1 citations51