Inventor
BURGGRAF JURGEN
AT16 patents
⚠️ This page may combine multiple inventors who share the name “BURGGRAF JURGEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EV GROUP E THALLNER GMBH
9 patentsUS10468286B2Nov 5, 2019
Method for the bonding and debonding of substrates
EV GROUP E THALLNER GMBH8 citations80
US12103787B2Oct 1, 2024
Method and device for transferring components
EV GROUP E THALLNER GMBH1 citations61
US10943810B2Mar 9, 2021
Device and method for bonding
EV GROUP E THALLNER GMBH0 citations61
US11024530B2Jun 1, 2021
Method for the bonding and debonding of substrates
EV GROUP E THALLNER GMBH1 citations59
US9390956B2Jul 12, 2016
Method for the temporary connection of a product substrate to a carrier substrate
EV GROUP E THALLNER GMBH2 citations59
US9245869B2Jan 26, 2016
Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
EV GROUP E THALLNER GMBH0 citations50
US10272660B2Apr 30, 2019
Bendable carrier mount, device and method for releasing a carrier substrate
EV GROUP E THALLNER GMBH0 citations49
US9984942B2May 29, 2018
Method and device for leveling a substrate stack
EV GROUP E THALLNER GMBH0 citations41
US9929124B2Mar 27, 2018
Method for bonding substrates
EV GROUP E THALLNER GMBH0 citations40
EV GROUP GMBH
6 patentsUS9381732B2Jul 5, 2016
Device for stripping a product substrate from a carrier substrate
EV GROUP GMBH9 citations83
US9457552B2Oct 4, 2016
Method for detaching a product substrate off a carrier substrate
EV GROUP GMBH0 citations51
US9381729B2Jul 5, 2016
Device for detaching a product substrate off a carrier substrate
EV GROUP GMBH0 citations51
US9186877B2Nov 17, 2015
Method for stripping a product substrate from a carrier substrate
EV GROUP GMBH0 citations51
US8986496B2Mar 24, 2015
Device and method for stripping a product substrate from a carrier substrate
EV GROUP GMBH0 citations51
US9449863B2Sep 20, 2016
Device for aligning and pre-fixing a wafer
EV GROUP GMBH0 citations48