Inventor

LIU CHENGYAN

CN2 patents

Patents

2 patents

US9397068B2Jul 19, 2016

Package in package (PiP) electronic device and manufacturing method thereof

QIN FEI2 citations56

US8951840B2Feb 10, 2015

FCOC (Flip Chip On Chip) package and manufacturing method thereof

QIN FEI1 citations46