Inventor

KANG MYUNG-SAM

KR104 patents

⚠️ This page may combine multiple inventors who share the name “KANG MYUNG-SAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG MYUNG-SAM

SAMSUNG ELECTRO MECH

Electronic component package and package-on-package structure including the same

Method of fabricating a printed circuit board including an embedded passive component

Printed circuit board having embedded electronic components and manufacturing method thereof

Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same

Printed circuit board including embedded resistor and method of fabricating the same

Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the same

Method of manufacturing a circuit board

Method for manufacturing a substrate with cavity

Printed circuit board including embedded passive component

Method for manufacturing substrate with cavity

Printed circuit board including embedded chips and method of fabricating the same

Method of fabricating multilayer printed circuit board

Fluxgate sensor integrated in printed circuit board and method for manufacturing the same

Multilayer seed pattern inductor and manufacturing method thereof

Coil component and method of manufacturing the same

Multilayered substrate and method of manufacturing the same

Board on chip package and manufacturing method thereof

Semiconductor package

Circuit board and manufacturing method thereof

Circuit board

Circuit board

Printed circuit board with weak magnetic field sensor

Fluxgate sensor integrated having stacked magnetic cores in printed circuit board and method for manufacturing the same

Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same

Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same

Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same

Coil electronic component and manufacturing method thereof

Circuit board including heat dissipation structure

Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same

Coil electronic component and method of manufacturing the same

Package board, method for manufacturing the same and package on package having the same

Method for preparing ball grid array board

Circuit board and circuit board assembly

Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer

Method of manufacturing circuit board

Method of manufacturing an electronic component package

Coil electronic component

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Fan-out semiconductor package

Semiconductor package and antenna module comprising the same

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package and antenna module comprising the same

Semiconductor package and antenna module comprising the same

Semiconductor package

Semiconductor package

Fan-out semiconductor package

Semiconductor package

Semiconductor package

KANG MYUNG SAM

Method of manufacturing high density printed circuit board