Inventor
LEE GUN-AH
KR2 patents
Patents
2 patentsUS7148080B2Dec 12, 2006
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
SAMSUNG ELECTRONICS CO LTD19 citations89
US10483150B2Nov 19, 2019
Apparatus for stacking semiconductor chips in a semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50