Inventor
TSAI YAO-TING
TW21 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YAO-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
20 patentsUS11004805B2May 11, 2021
Semiconductor device and method of fabricating same including two seal rings
WINBOND ELECTRONICS CORP2 citations68
US11424254B2Aug 23, 2022
Semiconductor device and manufacturing method of the same
WINBOND ELECTRONICS CORP2 citations66
US12471277B2Nov 11, 2025
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations61
US11974428B2Apr 30, 2024
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations61
US11877447B2Jan 16, 2024
Manufacturing method of semiconductor structure and flash memory
WINBOND ELECTRONICS CORP0 citations61
US11805644B2Oct 31, 2023
Manufacturing method of memory device
WINBOND ELECTRONICS CORP0 citations61
US11678484B2Jun 13, 2023
Semiconductor structure and manufacturing method thereof and flash memory
WINBOND ELECTRONICS CORP1 citations61
US11257833B2Feb 22, 2022
Memory device and manufacturing method thereof
WINBOND ELECTRONICS CORP0 citations61
US11251273B2Feb 15, 2022
Non-volatile memory device and method for manufacturing the same
WINBOND ELECTRONICS CORP0 citations61
US12190981B2Jan 7, 2025
Memory array having error checking and correction circuit
WINBOND ELECTRONICS CORP0 citations60
US11257922B2Feb 22, 2022
Self-aligned contact and method for forming the same
WINBOND ELECTRONICS CORP0 citations58
US11839075B2Dec 5, 2023
Semiconductor structure and the forming method thereof
WINBOND ELECTRONICS CORP0 citations55
US11785769B2Oct 10, 2023
Manufacturing method of semiconductor device including floating gate and control gate
WINBOND ELECTRONICS CORP0 citations55
US11302705B2Apr 12, 2022
Semiconductor structure and the forming method thereof
WINBOND ELECTRONICS CORP0 citations55
US11818884B2Nov 14, 2023
Method for manufacturing non-volatile memory device
WINBOND ELECTRONICS CORP0 citations51
US10971508B2Apr 6, 2021
Integrated circuit and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations50
US10147730B2Dec 4, 2018
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations50
US9972631B2May 15, 2018
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations50
US10580487B2Mar 3, 2020
Three dimensional NOR flash memory with isolated source lines and method of operating the same
WINBOND ELECTRONICS CORP0 citations47
US12040412B2Jul 16, 2024
Semiconductor device and method of forming the same
WINBOND ELECTRONICS CORP0 citations45