P

Inventor

TSAI YAO-TING

TW21 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YAO-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

20 patents
US11004805B2May 11, 2021

Semiconductor device and method of fabricating same including two seal rings

WINBOND ELECTRONICS CORP2 citations68
US11424254B2Aug 23, 2022

Semiconductor device and manufacturing method of the same

WINBOND ELECTRONICS CORP2 citations66
US12471277B2Nov 11, 2025

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US11974428B2Apr 30, 2024

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US11877447B2Jan 16, 2024

Manufacturing method of semiconductor structure and flash memory

WINBOND ELECTRONICS CORP0 citations61
US11805644B2Oct 31, 2023

Manufacturing method of memory device

WINBOND ELECTRONICS CORP0 citations61
US11678484B2Jun 13, 2023

Semiconductor structure and manufacturing method thereof and flash memory

WINBOND ELECTRONICS CORP1 citations61
US11257833B2Feb 22, 2022

Memory device and manufacturing method thereof

WINBOND ELECTRONICS CORP0 citations61
US11251273B2Feb 15, 2022

Non-volatile memory device and method for manufacturing the same

WINBOND ELECTRONICS CORP0 citations61
US12190981B2Jan 7, 2025

Memory array having error checking and correction circuit

WINBOND ELECTRONICS CORP0 citations60
US11257922B2Feb 22, 2022

Self-aligned contact and method for forming the same

WINBOND ELECTRONICS CORP0 citations58
US11839075B2Dec 5, 2023

Semiconductor structure and the forming method thereof

WINBOND ELECTRONICS CORP0 citations55
US11785769B2Oct 10, 2023

Manufacturing method of semiconductor device including floating gate and control gate

WINBOND ELECTRONICS CORP0 citations55
US11302705B2Apr 12, 2022

Semiconductor structure and the forming method thereof

WINBOND ELECTRONICS CORP0 citations55
US11818884B2Nov 14, 2023

Method for manufacturing non-volatile memory device

WINBOND ELECTRONICS CORP0 citations51
US10971508B2Apr 6, 2021

Integrated circuit and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US10147730B2Dec 4, 2018

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US9972631B2May 15, 2018

Memory device and method of manufacturing the same

WINBOND ELECTRONICS CORP0 citations50
US10580487B2Mar 3, 2020

Three dimensional NOR flash memory with isolated source lines and method of operating the same

WINBOND ELECTRONICS CORP0 citations47
US12040412B2Jul 16, 2024

Semiconductor device and method of forming the same

WINBOND ELECTRONICS CORP0 citations45

WINBOND ELECTROICS CORP

1 patent