Inventor
LEE YANG JE
KR27 patents
⚠️ This page may combine multiple inventors who share the name “LEE YANG JE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
23 patentsUS8882954B2Nov 11, 2014
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH17 citations92
US7281328B2Oct 16, 2007
Method of fabricating rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH20 citations89
US9743529B2Aug 22, 2017
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH9 citations83
US9338899B2May 10, 2016
Method of manufacturing a rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH8 citations80
US6475299B1Nov 5, 2002
Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same
SAMSUNG ELECTRO MECH14 citations77
US10299373B2May 21, 2019
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH1 citations73
US10368445B2Jul 30, 2019
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH2 citations72
US10034368B2Jul 24, 2018
Flying tail type rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH2 citations72
US9955580B2Apr 24, 2018
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH1 citations63
US7563104B2Jul 21, 2009
Printed circuit board having connectors
SAMSUNG ELECTRO MECH5 citations63
US11658417B2May 23, 2023
Antenna substrate
SAMSUNG ELECTRO MECH0 citations61
US12341252B2Jun 24, 2025
Antenna substrate and electronic device including the same
SAMSUNG ELECTRO MECH0 citations60
US11228107B2Jan 18, 2022
Antenna substrate
SAMSUNG ELECTRO MECH0 citations59
US6489012B1Dec 3, 2002
Printed circuit board for RAMBUS
SAMSUNG ELECTRO MECH6 citations58
US10091871B2Oct 2, 2018
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US10674610B1Jun 2, 2020
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US10602616B2Mar 24, 2020
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US7084098B2Aug 1, 2006
Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process
SAMSUNG ELECTRO MECH1 citations51
US12119565B2Oct 15, 2024
Antenna substrate
SAMSUNG ELECTRO MECH0 citations50
US9521760B2Dec 13, 2016
Rigid flexible printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations50
US9706658B2Jul 11, 2017
Portable terminal
SAMSUNG ELECTRO MECH0 citations46
US9351403B2May 24, 2016
Portable terminal
SAMSUNG ELECTRO MECH0 citations46
US10881000B1Dec 29, 2020
Printed circuit board
SAMSUNG ELECTRO MECH0 citations37