P

Inventor

SHIN JAE HO

KR60 patents
⚠️ This page may combine multiple inventors who share the name “SHIN JAE HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

20 patents
US8882954B2Nov 11, 2014

Method of manufacturing rigid-flexible printed circuit board

SAMSUNG ELECTRO MECH17 citations92
US9743529B2Aug 22, 2017

Multilayer rigid flexible printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH9 citations83
US10299373B2May 21, 2019

Method of manufacturing rigid-flexible printed circuit board

SAMSUNG ELECTRO MECH1 citations73
US10368445B2Jul 30, 2019

Multilayer rigid flexible printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH2 citations72
US10034368B2Jul 24, 2018

Flying tail type rigid-flexible printed circuit board

SAMSUNG ELECTRO MECH2 citations72
US11259404B2Feb 22, 2022

Rigid-flexible printed circuit board and electronic component module

SAMSUNG ELECTRO MECH2 citations71
US11172574B2Nov 9, 2021

Printed circuit board assembly

SAMSUNG ELECTRO MECH2 citations71
US9005456B2Apr 14, 2015

Method for manufacturing printed circuit board

SAMSUNG ELECTRO MECH6 citations67
US9955580B2Apr 24, 2018

Method of manufacturing rigid-flexible printed circuit board

SAMSUNG ELECTRO MECH1 citations63
US12349283B2Jul 1, 2025

Electronic component embedded substrate

SAMSUNG ELECTRO MECH0 citations62
US12279364B2Apr 15, 2025

Printed circuit board with plurality of condctor patterns and vias

SAMSUNG ELECTRO MECH0 citations62
US12185471B2Dec 31, 2024

Electronic component embedded substrate

SAMSUNG ELECTRO MECH0 citations62
US11483422B2Oct 25, 2022

Printed circuit board and electronic device comprising the same

SAMSUNG ELECTRO MECH1 citations62
US11099606B2Aug 24, 2021

Printed circuit board, display device comprising the same, and manufacturing method for the same

SAMSUNG ELECTRO MECH0 citations62
US12477656B2Nov 18, 2025

Printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations52
US10091871B2Oct 2, 2018

Method of manufacturing rigid-flexible printed circuit board

SAMSUNG ELECTRO MECH0 citations52
US12336098B2Jun 17, 2025

Printed circuit board

SAMSUNG ELECTRO MECH0 citations51
US10674610B1Jun 2, 2020

Multilayer rigid flexible printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US10602616B2Mar 24, 2020

Multilayer rigid flexible printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US9521760B2Dec 13, 2016

Rigid flexible printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations50

LG DISPLAY CO LTD

5 patents

HYUNDAI MOTOR CO LTD

5 patents

SCHOENFISCH MARK H

4 patents

I SENS INC

3 patents

UNIV NORTH CAROLINA

2 patents

UNIV NORTH CAROLINA CHAPEL HILL

2 patents

INFOPIA CO LTD

1 patent

GEUN SIG CHA

1 patent

LEE YANG JE

1 patent

CHA GEUN SIG

1 patent

SHIN JAE-HO

1 patent

SILICON DISPLAY TECH

1 patent

SEOUL NAT UNIV R&DB FOUNDATION

1 patent

SAMSUNG ELECTRONICS CO LTD

1 patent

KIM YOUNG-JIN

1 patent

Showing the top 50 of 60 patents by PatentIndex Score.