Inventor
YANG DEK GIN
KR39 patents
⚠️ This page may combine multiple inventors who share the name “YANG DEK GIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
33 patentsUS8882954B2Nov 11, 2014
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH17 citations92
US7082679B2Aug 1, 2006
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
SAMSUNG ELECTRO MECH17 citations92
US6996305B2Feb 7, 2006
Printed circuit board with opto-via holes and process of forming the opto-via holes
SAMSUNG ELECTRO MECH32 citations92
US6839476B2Jan 4, 2005
Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
SAMSUNG ELECTRO MECH32 citations92
US7281328B2Oct 16, 2007
Method of fabricating rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH20 citations89
US7203388B2Apr 10, 2007
Printed circuit board including waveguide and method of producing the same
SAMSUNG ELECTRO MECH23 citations89
US7033457B2Apr 25, 2006
Method of attaching optical waveguide component to printed circuit board
SAMSUNG ELECTRO MECH13 citations84
US6905569B2Jun 14, 2005
Method of embedding optical fiber in multilayer printed circuit board
SAMSUNG ELECTRO MECH13 citations84
US9743529B2Aug 22, 2017
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH9 citations83
US7453045B2Nov 18, 2008
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
SAMSUNG ELECTRO MECH12 citations83
US7999746B2Aug 16, 2011
Printed circuit board having built-in antenna
SAMSUNG ELECTRO MECH11 citations81
US7347950B2Mar 25, 2008
Rigid flexible printed circuit board and method of fabricating same
SAMSUNG ELECTRO MECH14 citations79
US6475299B1Nov 5, 2002
Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same
SAMSUNG ELECTRO MECH14 citations77
US6879423B2Apr 12, 2005
Printed circuit board assembly with multi-channel block-type optical devices packaged therein
SAMSUNG ELECTRO MECH11 citations74
US10299373B2May 21, 2019
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH1 citations73
US7197202B2Mar 27, 2007
Optical printed circuit board for long-distance signal transmission
SAMSUNG ELECTRO MECH7 citations73
US7025849B2Apr 11, 2006
Method of attaching optical waveguide component to printed circuit board
SAMSUNG ELECTRO MECH9 citations73
US6978058B2Dec 20, 2005
Multi-layer PCB and method for coupling block type multichannel optical signals
SAMSUNG ELECTRO MECH7 citations73
US10368445B2Jul 30, 2019
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH2 citations72
US10034368B2Jul 24, 2018
Flying tail type rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH2 citations72
US9955580B2Apr 24, 2018
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH1 citations63
US7046870B2May 16, 2006
Method of fabricating multi-layered printed circuit board for optical waveguides
SAMSUNG ELECTRO MECH4 citations62
US6882161B2Apr 19, 2005
Method of measuring dielectric constant of PCB for RIMM
SAMSUNG ELECTRO MECH4 citations62
US7973619B2Jul 5, 2011
Electro-magnetic bandgap structure
SAMSUNG ELECTRO MECH3 citations59
US7280716B2Oct 9, 2007
Printed circuit board including waveguide and method of producing the same
SAMSUNG ELECTRO MECH2 citations59
US10091871B2Oct 2, 2018
Method of manufacturing rigid-flexible printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US7350295B2Apr 1, 2008
Method of fabricating multi-layered printed circuit board for optical waveguides
SAMSUNG ELECTRO MECH0 citations52
US10674610B1Jun 2, 2020
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US10602616B2Mar 24, 2020
Multilayer rigid flexible printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
US7084098B2Aug 1, 2006
Brown oxide pretreatment composition for cleaning copper surface and improving adhesion of polyimide surface, and method for improving adhesion of polyimide surface by applying the same to brown oxide process
SAMSUNG ELECTRO MECH1 citations51
US7810232B2Oct 12, 2010
Method of manufacturing a circuit board
SAMSUNG ELECTRO MECH1 citations48
US7473099B2Jan 6, 2009
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations48
US7981317B2Jul 19, 2011
Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
SAMSUNG ELECTRO MECH0 citations47
CHO WON WOO
3 patentsUS8711055B2Apr 29, 2014
Printed circuit board including electromagnetic bandgap structure
CHO WON WOO4 citations70
US8330048B2Dec 11, 2012
Electromagnetic bandgap structure and printed circuit board having the same
CHO WON WOO5 citations60
US8399777B2Mar 19, 2013
Electromagnetic bandgap structure and printed circuit board having the same
CHO WON WOO1 citations49