Inventor
CHEN CHUN-KUANG
TW106 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHUN-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
36 patentsUS9418868B1Aug 16, 2016
Method of fabricating semiconductor device with reduced trench distortions
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations92
US10177133B2Jan 8, 2019
Semiconductor device including source/drain contact having height below gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9911697B2Mar 6, 2018
Power strap structure for high performance and low current density
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9793211B2Oct 17, 2017
Dual power structure with connection pins
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US9431297B2Aug 30, 2016
Method of forming an interconnect structure for a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11862623B2Jan 2, 2024
Semiconductor device including source/drain contact having height below gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11581300B2Feb 14, 2023
Semiconductor device including source/drain contact having height below gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11063005B2Jul 13, 2021
Via rail solution for high power electromigration
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10861790B2Dec 8, 2020
Power strap structure for high performance and low current density
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10833061B2Nov 10, 2020
Semiconductor device including source/drain contact having height below gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10714357B2Jul 14, 2020
Methods for improved critical dimension uniformity in a semiconductor device fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10642158B2May 5, 2020
Method of controlling reticle masking blade positioning to minimize impact on critical dimension uniformity and device for controlling reticle masking blade positioning
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510688B2Dec 17, 2019
Via rail solution for high power electromigration
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10388523B2Aug 20, 2019
Lithographic technique for feature cut by line-end shrink
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10366973B2Jul 30, 2019
Layout modification method for exposure manufacturing process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276499B2Apr 30, 2019
Dual power structure with connection pins
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10169515B2Jan 1, 2019
Layout modification method and system
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10170422B2Jan 1, 2019
Power strap structure for high performance and low current density
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10163654B2Dec 25, 2018
Method of fabricating semiconductor device with reduced trench distortions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10096522B2Oct 9, 2018
Dummy MOL removal for performance enhancement
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9997404B2Jun 12, 2018
Method of forming an interconnect structure for a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9991132B2Jun 5, 2018
Lithographic technique incorporating varied pattern materials
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9984876B2May 29, 2018
Lithographic technique for feature cut by line-end shrink
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9728407B2Aug 8, 2017
Method of forming features with various dimensions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9684236B1Jun 20, 2017
Method of patterning a film layer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9613850B2Apr 4, 2017
Lithographic technique for feature cut by line-end shrink
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9449880B1Sep 20, 2016
Fin patterning methods for increased process margin
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US10880981B2Dec 29, 2020
Collector pellicle
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10203606B1Feb 12, 2019
Apparatus and method for dispensing developer onto semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10146141B2Dec 4, 2018
Lithography process and system with enhanced overlay quality
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10007177B2Jun 26, 2018
Method to define multiple layer patterns using double exposures
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US12336296B2Jun 17, 2025
Semiconductor device including source/drain contact having height below gate stack
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11088092B2Aug 10, 2021
Via rail solution for high power electromigration
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11043426B2Jun 22, 2021
Dummy MOL removal for performance enhancement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11024579B2Jun 1, 2021
Dual power structure with connection pins
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9412649B1Aug 9, 2016
Method of fabricating semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
TAIWAN SEMICONDUCTOR MFG
5 patentsUS7091502B2Aug 15, 2006
Apparatus and method for immersion lithography
TAIWAN SEMICONDUCTOR MFG72 citations98
US7935477B2May 3, 2011
Double patterning strategy for contact hole and trench
TAIWAN SEMICONDUCTOR MFG12 citations84
US7180572B2Feb 20, 2007
Immersion optical projection system
TAIWAN SEMICONDUCTOR MFG11 citations84
US6973636B2Dec 6, 2005
Method of defining forbidden pitches for a lithography exposure tool
TAIWAN SEMICONDUCTOR MFG12 citations82
US7732109B2Jun 8, 2010
Method and system for improving critical dimension uniformity
TAIWAN SEMICONDUCTOR MFG6 citations73
CHEN CHUN-KUANG
2 patentsLEXTAR ELECTRONICS CORP
2 patentsFAR EASTONE TELECOMM CO LTD
1 patentCHANG SHIH-MING
1 patentWEN MING-CHANG
1 patentYAO HSIN-CHIEH
1 patentGOOEE LTD
1 patentShowing the top 50 of 106 patents by PatentIndex Score.