Inventor

HEINEN KATHERINE G

US17 patents

⚠️ This page may combine multiple inventors who share the name “HEINEN KATHERINE G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEINEN KATHERINE G

TEXAS INSTRUMENTS INC

Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer

Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid

Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads

Integrated circuit device and method to prevent cracking during surface mount

Insulated lead frame for integrated circuits and method of manufacture thereof

Integrated circuit device having an aminopropyltriethoxysilane coating

Wafer-scale assembly of chip-size packages

Multi-chip module testing

Wafer-scale assembly of chip-size packages

Stress relief matrix for integrated circuit packaging

Technique for enhancing adhesion capability of heat spreaders in molded packages

Ball grid assembly with solder columns

Technique for enhancing adhesion capability of heat spreaders in molded packages

Ball grid assembly with solder columns

Stress relief matrix for integrated circuit packaging

HITACHI LTD

Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation

Packaged semiconductor device and a leadframe therefor