Inventor

EDWARDS DARVIN R

US22 patents

⚠️ This page may combine multiple inventors who share the name “EDWARDS DARVIN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EDWARDS DARVIN R

TEXAS INSTRUMENTS INC

Integrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereof

Array-processed stacked semiconductor packages

Temperature field controlled scheduling for processing systems

Sacrificial structures for arresting insulator cracks in semiconductor devices

Method and apparatus for attaching particles to a substrate

System and method for high performance heat sink for multiple chip devices

System and method for self-leveling heat sink for multiple height devices

Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board

System for modeling an integrated chip package and method of operation

Multi-chip module testing

Wafer-scale assembly of chip-size packages

Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers

Semiconductor package having etched foil capacitor integrated into leadframe

Method and apparatus to minimize power and ground bounce in a logic device

System and method for high performance heat sink for multiple chip devices

Thermal analysis system and method of operation

Semiconductor package having etched foil capacitor integrated into leadframe

Method for contacting agglomerate terminals of semiconductor packages

Solder joints for copper metallization having reduced interfacial voids

Method of making ball grid array columns

Semiconductor package having etched foil capacitor integrated into leadframe

EDWARDS DARVIN R

Semiconductor device having agglomerate terminals