Inventor
JACOBS ELIZABETH G
US5 patents
Patents
5 patentsUS6730541B2May 4, 2004
Wafer-scale assembly of chip-size packages
TEXAS INSTRUMENTS INC33 citations91
US5894173AApr 13, 1999
Stress relief matrix for integrated circuit packaging
TEXAS INSTRUMENTS INC49 citations91
US6580170B2Jun 17, 2003
Semiconductor device protective overcoat with enhanced adhesion to polymeric materials
TEXAS INSTRUMENTS INC13 citations82
US6787397B2Sep 7, 2004
Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication
TEXAS INSTRUMENTS INC11 citations72
US6096578AAug 1, 2000
Stress relief matrix for integrated circuit packaging
TEXAS INSTRUMENTS INC2 citations61