Inventor
KIM YONGHOON
KR35 patents
⚠️ This page may combine multiple inventors who share the name “KIM YONGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS8766429B2Jul 1, 2014
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD28 citations92
US11682622B2Jun 20, 2023
Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure
SAMSUNG ELECTRONICS CO LTD5 citations86
US11217531B2Jan 4, 2022
Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure
SAMSUNG ELECTRONICS CO LTD2 citations73
US10971451B2Apr 6, 2021
Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure
SAMSUNG ELECTRONICS CO LTD2 citations73
US10211190B2Feb 19, 2019
Semiconductor packages having reduced stress
SAMSUNG ELECTRONICS CO LTD5 citations73
US11101831B2Aug 24, 2021
RF signal transmission apparatus and control method therefor
SAMSUNG ELECTRONICS CO LTD4 citations70
US9659852B2May 23, 2017
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations70
US10756076B2Aug 25, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US11050495B2Jun 29, 2021
Electronic device including transceiver for calibrating I/Q imbalance in millimeter wave communication system and method of operating same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11469148B2Oct 11, 2022
Semiconductor package having a redistribution layer for package-on-package structure
SAMSUNG ELECTRONICS CO LTD1 citations58
US12394893B2Aug 19, 2025
Method and apparatus for calibrating phased array antenna
SAMSUNG ELECTRONICS CO LTD0 citations56
US9041222B2May 26, 2015
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US8866310B2Oct 21, 2014
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations51
US12580594B2Mar 17, 2026
Method and apparatus for detecting reflection coefficient
SAMSUNG ELECTRONICS CO LTD0 citations47
US12413317B2Sep 9, 2025
Apparatus and method for error correction in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations47
US11205631B2Dec 21, 2021
Semiconductor package including multiple semiconductor chips
SAMSUNG ELECTRONICS CO LTD0 citations47
US11251882B2Feb 15, 2022
Device and method for calibrating phased array antenna
SAMSUNG ELECTRONICS CO LTD0 citations45
US11709196B2Jul 25, 2023
Method and apparatus for detecting circuit defects
SAMSUNG ELECTRONICS CO LTD0 citations44
US9560767B2Jan 31, 2017
Wiring boards and semiconductor modules including the same
SAMSUNG ELECTRONICS CO LTD0 citations42
US9799591B2Oct 24, 2017
Semiconductor packages including thermal blocks
SAMSUNG ELECTRONICS CO LTD0 citations40
US12516842B2Jan 6, 2026
Device and method for recovering thermal energy in room
SAMSUNG ELECTRONICS CO LTD0 citations39
KIM YONGHOON
7 patentsUS9666517B2May 30, 2017
Semiconductor packages with a substrate between a pair of substrates
KIM YONGHOON3 citations72
US8946892B2Feb 3, 2015
Semiconductor package
KIM YONGHOON5 citations72
US8743560B2Jun 3, 2014
Circuit board and semiconductor module including the same
KIM YONGHOON5 citations72
US9105503B2Aug 11, 2015
Package-on-package device
KIM YONGHOON5 citations71
US8269342B2Sep 18, 2012
Semiconductor packages including heat slugs
KIM YONGHOON6 citations69
US9099326B2Aug 4, 2015
Stack-type semiconductor package
KIM YONGHOON2 citations61
US9355976B2May 31, 2016
Semiconductor memory chips and stack-type semiconductor packages including the same
KIM YONGHOON2 citations60