Inventor
TSAI HSIEN-CHOU
TW3 patents
Patents
3 patentsUS10923435B2Feb 16, 2021
Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
TSAI SHIANN TSONG1 citations54
US11211340B2Dec 28, 2021
Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
TSAI SHIANN TSONG0 citations44
US10896880B2Jan 19, 2021
Semiconductor package with in-package compartmental shielding and fabrication method thereof
TSAI SHIANN TSONG0 citations44