Inventor

TIEN CHIUNG-YUEH

TW2 patents

Patents

2 patents

US10696543B1Jun 30, 2020

Waterproof MEMS chip package structure

LINGSEN PREC INDUSTRIES LTD1 citations55

US11041774B2Jun 22, 2021

Pressure sensor package

LINGSEN PREC INDUSTRIES LTD1 citations49