Inventor
ARISAWA TATSUYA
JP9 patents
Patents
9 patentsUS11267225B2Mar 8, 2022
Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring board
PANASONIC IP MAN CO LTD0 citations51
US12109779B2Oct 8, 2024
Copper-clad laminate, wiring board, and copper foil with resin
PANASONIC IP MAN CO LTD0 citations50
US10820413B2Oct 27, 2020
Metal-clad laminate, metal member with resin, and wiring board
PANASONIC IP MAN CO LTD0 citations50
US11895770B2Feb 6, 2024
Copper-clad laminate, wiring board, and copper foil provided with resin
PANASONIC IP MAN CO LTD0 citations48
US11312858B2Apr 26, 2022
Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations48
US9775239B2Sep 26, 2017
Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board
PANASONIC IP MAN CO LTD0 citations47
US11330710B2May 10, 2022
Metal-clad laminated board, metal member provided with resin, and wiring board
PANASONIC IP MAN CO LTD0 citations46
US11078361B2Aug 3, 2021
Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations46
US12447719B2Oct 21, 2025
Metal-clad laminate, wiring board, resin-including metal foil, and resin composition
PANASONIC IP MAN CO LTD0 citations45