Inventor
TSENG KUO-SHU
TW28 patents
⚠️ This page may combine multiple inventors who share the name “TSENG KUO-SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10345716B2Jul 9, 2019
Metrology method in reticle transportation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10074547B2Sep 11, 2018
Photoresist nozzle device and photoresist supply system
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US11742227B2Aug 29, 2023
Wafer cleaning system and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US10515833B2Dec 24, 2019
Wafer cleaning system and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations70
US9919350B2Mar 20, 2018
Cup-wash device, semiconductor apparatus, and cup cleaning method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12581897B2Mar 17, 2026
Liquid storage for facility chemical supply system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11769678B2Sep 26, 2023
Liquid storage for facility chemical supply system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087602B2Sep 10, 2024
Wafer cleaning method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12059692B2Aug 13, 2024
Nozzle assembly for use with liquid dispensing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11642682B2May 9, 2023
Pipe design for prevent drip
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11387123B2Jul 12, 2022
Metrology method in wafer transportation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9770092B2Sep 26, 2017
Brush, back surface treatment assembly and method for cleaning substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10651066B2May 12, 2020
Metrology method in wafer transportation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10864533B2Dec 15, 2020
Integrated circuit, system for and method of forming an integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US9570334B2Feb 14, 2017
Method and system for positioning wafer in semiconductor manufacturing fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9892982B2Feb 13, 2018
Method for controlling exhaust flow in wafer processing module
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
VANGUARD INT SEMICONDUCT CORP
5 patentsUS6046083AApr 4, 2000
Growth enhancement of hemispherical grain silicon on a doped polysilicon storage node capacitor structure, for dynamic random access memory applications
VANGUARD INT SEMICONDUCT CORP85 citations96
US6037219AMar 14, 2000
One step in situ doped amorphous silicon layers used for selective hemispherical grain silicon formation for crown shaped capacitor applications
VANGUARD INT SEMICONDUCT CORP45 citations92
US5877052AMar 2, 1999
Resolution of hemispherical grained silicon peeling and row-disturb problems for dynamic random access memory, stacked capacitor structures
VANGUARD INT SEMICONDUCT CORP39 citations92
US5746512AMay 5, 1998
Method for reducing crack of polysilicon in a quartz tube and boat
VANGUARD INT SEMICONDUCT CORP11 citations74
US5882962AMar 16, 1999
Method of fabricating MOS transistor having a P+ -polysilicon gate
VANGUARD INT SEMICONDUCT CORP12 citations72
DELTA ELECTRONICS INC
2 patentsUS9968877B2May 15, 2018
Intelligent air-conditioning controlling system and intelligent controlling method for the same
DELTA ELECTRONICS INC5 citations81
US10625193B2Apr 21, 2020
Intelligent air-conditioning controlling system and intelligent controlling method for the same
DELTA ELECTRONICS INC1 citations70
EXCELLENCE OPTO INC
2 patentsUS10361352B1Jul 23, 2019
High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission
EXCELLENCE OPTO INC1 citations58
US10096745B1Oct 9, 2018
Light emitting diode capable of generating different light colors over single wafer
EXCELLENCE OPTO INC0 citations47