Inventor

LI SHIDONG

US60 patents

⚠️ This page may combine multiple inventors who share the name “LI SHIDONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI SHIDONG

IBM

Multichip module with stiffening frame and associated covers

Tamper-respondent assembly with structural material within sealed inner compartment

Integrated circuit chip carrier with in-plane thermal conductance layer

Limiting electronic package warpage

Interposer with lattice construction and embedded conductive metal structures

Packaging for high speed chip to chip communication

Interposer with lattice construction and embedded conductive metal structures

Multichip module with stiffening frame and associated covers

Circuit substrate with mixed pitch wiring

Laminated stiffener to control the warpage of electronic chip carriers

Interposer with lattice construction and embedded conductive metal structures

Packaging for high speed chip to chip communication

Reduced-warpage laminate structure

Reduced-warpage laminate structure

Heterogeneous thermal interface material for corner and or edge degradation mitigation

Electronic module assembly with patterned adhesive array

Active control of electronic package warpage

Lid attach optimization to limit electronic package warpage

Packaging for high speed chip to chip communication

Lid attach optimization to limit electronic package warpage

Electronic package structure with offset stacked chips and top and bottom side cooling lid

Asymmetric die bonding

Polygon integrated circuit (IC) packaging

Multiple chip carrier for bridge assembly

Reduction of laminate failure in integrated circuit (IC) device carrier

Flexible circuit structure for circuit line bending

Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers

Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers

High bandwidth module

High bandwidth module

Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors

Lid/heat spreader having targeted flexibility

Near tier decoupling capacitors

Fatigue failure resistant electronic package

Reduced-warpage laminate structure

Method of forming an electronic package

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Limiting electronic package warpage with semiconductor chip lid and lid-ring

Maintaining laminate flatness using magnetic retention during chip joining

Laminate substrates having radial cut metallic planes

GLOBALFOUNDRIES INC

Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process

Electronic module assembly with patterned adhesive array

Qingdao haier refrigerator co ltd

Refrigerator

Refrigerator and control method thereof

HAIER SMART HOME CO LTD

Door-in-door having display screen assembly and refrigerator having the same

(unassigned)

Method for constructing mobile wireless antenna systems

LI SHIDONG

Method and apparatus for constructing general wireless antenna systems

UNIV GUILIN TECHNOLOGY

Aquatic weed planting plate for aquarium