Inventor
PRABHU ASHOK N
34 patents
⚠️ This page may combine multiple inventors who share the name “PRABHU ASHOK N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RCA CORP
14 patentsUS4415624ANov 15, 1983
Air-fireable thick film inks
RCA CORP46 citations92
US4733018AMar 22, 1988
Thick film copper conductor inks
RCA CORP22 citations82
US4401709AAug 30, 1983
Overglaze inks
RCA CORP17 citations82
US4376725AMar 15, 1983
Conductor inks
RCA CORP21 citations82
US4369220AJan 18, 1983
Crossover dielectric inks used in forming a multilayer electrical circuit
RCA CORP25 citations82
US4369254AJan 18, 1983
Crossover dielectric inks
RCA CORP18 citations82
US4619836AOct 28, 1986
Method of fabricating thick film electrical components
RCA CORP25 citations81
US4399320AAug 16, 1983
Conductor inks
RCA CORP10 citations74
US4379195AApr 5, 1983
Low value resistor inks
RCA CORP15 citations74
US4377642AMar 22, 1983
Overglaze inks
RCA CORP13 citations74
US4479890AOct 30, 1984
Thick film resistor inks
RCA CORP15 citations71
US4467009AAug 21, 1984
Indium oxide resistor inks
RCA CORP3 citations63
US4452844AJun 5, 1984
Low value resistor inks
RCA CORP4 citations63
US4380750AApr 19, 1983
Indium oxide resistor inks
RCA CORP5 citations63
GEN ELECTRIC
13 patentsUS5277724AJan 11, 1994
Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
GEN ELECTRIC54 citations96
US5256469AOct 26, 1993
Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
GEN ELECTRIC64 citations92
US4880567ANov 14, 1989
Thick film copper conductor inks
GEN ELECTRIC45 citations92
US4830988AMay 16, 1989
Dielectric inks for multilayer copper circuits
GEN ELECTRIC26 citations92
US4816615AMar 28, 1989
Thick film copper conductor inks
GEN ELECTRIC24 citations92
US4863517ASep 5, 1989
Via fill ink composition for integrated circuits
GEN ELECTRIC12 citations74
US4788163ANov 29, 1988
Devitrifying glass frits
GEN ELECTRIC17 citations74
US4772574ASep 20, 1988
Ceramic filled glass dielectrics
GEN ELECTRIC8 citations74
US4997795AMar 5, 1991
Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide
GEN ELECTRIC17 citations73
US4874550AOct 17, 1989
Thick-film copper conductor inks
GEN ELECTRIC13 citations73
US4808673AFeb 28, 1989
Dielectric inks for multilayer copper circuits
GEN ELECTRIC17 citations73
US4808770AFeb 28, 1989
Thick-film copper conductor inks
GEN ELECTRIC13 citations73
US4810420AMar 7, 1989
Thick film copper via-fill inks
GEN ELECTRIC14 citations72
SARNOFF DAVID RES CENTER
7 patentsUS5581876ADec 10, 1996
Method of adhering green tape to a metal support substrate with a bonding glass
SARNOFF DAVID RES CENTER104 citations97
US5216207AJun 1, 1993
Low temperature co-fired multilayer ceramic circuit boards with silver conductors
SARNOFF DAVID RES CENTER63 citations95
US5514451AMay 7, 1996
Conductive via fill inks for ceramic multilayer circuit boards on support substrates
SARNOFF DAVID RES CENTER29 citations92
US5035939AJul 30, 1991
Manufacture of printed circuit boards
SARNOFF DAVID RES CENTER18 citations77
US5124282AJun 23, 1992
Glasses and overglaze inks made therefrom
SARNOFF DAVID RES CENTER6 citations74
USRE34982EJun 27, 1995
Thick film copper via fill inks
SARNOFF DAVID RES CENTER4 citations63
US5082804AJan 21, 1992
Thick film copper via fill inks
SARNOFF DAVID RES CENTER4 citations63