Inventor
HANG KENNETH W
38 patents
⚠️ This page may combine multiple inventors who share the name “HANG KENNETH W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RCA CORP
18 patentsUS4451507AMay 29, 1984
Automatic liquid dispensing apparatus for spinning surface of uniform thickness
RCA CORP135 citations95
US4256796AMar 17, 1981
Partially devitrified porcelain composition and articles prepared with same
RCA CORP89 citations95
US4415624ANov 15, 1983
Air-fireable thick film inks
RCA CORP46 citations92
US4733018AMar 22, 1988
Thick film copper conductor inks
RCA CORP22 citations82
US4401709AAug 30, 1983
Overglaze inks
RCA CORP17 citations82
US4376725AMar 15, 1983
Conductor inks
RCA CORP21 citations82
US4369220AJan 18, 1983
Crossover dielectric inks used in forming a multilayer electrical circuit
RCA CORP25 citations82
US4369254AJan 18, 1983
Crossover dielectric inks
RCA CORP18 citations82
US4126384ANov 21, 1978
Self-illuminated liquid crystal display device
RCA CORP26 citations82
US4399320AAug 16, 1983
Conductor inks
RCA CORP10 citations74
US4379195AApr 5, 1983
Low value resistor inks
RCA CORP15 citations74
US4377642AMar 22, 1983
Overglaze inks
RCA CORP13 citations74
US4355115AOct 19, 1982
Borosilicate glass frit with MgO and BaO
RCA CORP12 citations73
US4355114AOct 19, 1982
Partially devitrified porcelain containing BaO.2MgO.2SiO2 and 2MgO.B2 O3 crystalline phases obtained from alkali metal free divalent metal oxide borosilicate glass
RCA CORP16 citations73
US4376031AMar 8, 1983
Apparatus for electrophoretic deposition
RCA CORP8 citations66
US4467009AAug 21, 1984
Indium oxide resistor inks
RCA CORP3 citations63
US4452844AJun 5, 1984
Low value resistor inks
RCA CORP4 citations63
US4380750AApr 19, 1983
Indium oxide resistor inks
RCA CORP5 citations63
GEN ELECTRIC
11 patentsUS4880567ANov 14, 1989
Thick film copper conductor inks
GEN ELECTRIC45 citations92
US4830988AMay 16, 1989
Dielectric inks for multilayer copper circuits
GEN ELECTRIC26 citations92
US4816615AMar 28, 1989
Thick film copper conductor inks
GEN ELECTRIC24 citations92
US4863517ASep 5, 1989
Via fill ink composition for integrated circuits
GEN ELECTRIC12 citations74
US4788163ANov 29, 1988
Devitrifying glass frits
GEN ELECTRIC17 citations74
US4772574ASep 20, 1988
Ceramic filled glass dielectrics
GEN ELECTRIC8 citations74
US4997795AMar 5, 1991
Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide
GEN ELECTRIC17 citations73
US4874550AOct 17, 1989
Thick-film copper conductor inks
GEN ELECTRIC13 citations73
US4808770AFeb 28, 1989
Thick-film copper conductor inks
GEN ELECTRIC13 citations73
US4808673AFeb 28, 1989
Dielectric inks for multilayer copper circuits
GEN ELECTRIC17 citations73
US4810420AMar 7, 1989
Thick film copper via-fill inks
GEN ELECTRIC14 citations72
DU PONT
5 patentsUS5378408AJan 3, 1995
Lead-free thick film paste composition
DU PONT175 citations97
US5468695ANov 21, 1995
Lead-free thick film paste composition
DU PONT60 citations95
US4959330ASep 25, 1990
Crystallizable glass and thick film compositions thereof
DU PONT37 citations92
US5137848AAug 11, 1992
Dielectric composition containing kerf additive
DU PONT22 citations89
US5393465AFeb 28, 1995
Light-absorbing dielectric compositions
DU PONT12 citations70