Inventor
ITO TOSHIHIKO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “ITO TOSHIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
9 patentsUS6692793B2Feb 17, 2004
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
HITACHI CHEMICAL CO LTD16 citations91
US6583198B2Jun 24, 2003
Photo curable resin composition and photosensitive element
HITACHI CHEMICAL CO LTD15 citations91
US6238840B1May 29, 2001
Photosensitive resin composition
HITACHI CHEMICAL CO LTD38 citations91
US5885723AMar 23, 1999
Bonding film for printed circuit boards
HITACHI CHEMICAL CO LTD12 citations71
US4795785AJan 3, 1989
Coating resin composition
HITACHI CHEMICAL CO LTD16 citations71
US7071243B2Jul 4, 2006
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
HITACHI CHEMICAL CO LTD3 citations61
US5874518AFeb 23, 1999
Epoxy-modified polyamide resin
HITACHI CHEMICAL CO LTD0 citations52
US5625026AApr 29, 1997
Amid group-containing diisocyanates and amide group-containing epoxy resins
HITACHI CHEMICAL CO LTD1 citations52
US5591813AJan 7, 1997
Amide group-containing diisocyanates and amide group-containing epoxy resins
HITACHI CHEMICAL CO LTD0 citations52
NIPPON SOKEN
5 patentsUS4354820AOct 19, 1982
Extrusion die and method for producing extrusion die for forming a honeycomb structure
NIPPON SOKEN59 citations96
US4381912AMay 3, 1983
Extrusion die for forming a honeycomb structure
NIPPON SOKEN41 citations92
US4373895AFeb 15, 1983
Extrusion die and method for producing extrusion die for forming a honeycomb structure
NIPPON SOKEN45 citations92
US4384841AMay 24, 1983
Extrusion die for extruding a honeycomb structure
NIPPON SOKEN30 citations89
US4640454AFeb 3, 1987
Method for producing extrusion die for forming a honeycomb structure
NIPPON SOKEN15 citations74