Inventor
AKASAKI HIDEHIKO
JP10 patents
Patents
10 patentsUS6063640AMay 16, 2000
Semiconductor wafer testing method with probe pin contact
FUJITSU LTD68 citations96
US5861670AJan 19, 1999
Semiconductor device package
FUJITSU LTD60 citations95
US4682207AJul 21, 1987
Semiconductor device including leadless packages and a base plate for mounting the leadless packages
FUJITSU LTD72 citations94
US6166433ADec 26, 2000
Resin molded semiconductor device and method of manufacturing semiconductor package
FUJITSU LTD59 citations93
US4539622ASep 3, 1985
Hybrid integrated circuit device
FUJITSU LTD49 citations92
US4458291AJul 3, 1984
Package for enclosing semiconductor elements
FUJITSU LTD36 citations88
US4710250ADec 1, 1987
Method for producing a package for a semiconductor device
FUJITSU LTD10 citations73
US4689658AAug 25, 1987
Modular semiconductor device
FUJITSU LTD9 citations73
US4737884AApr 12, 1988
Semiconductor device module
FUJITSU LTD8 citations67
USD276719SDec 11, 1984
Integrated circuit device
FUJITSU LTD4 citations62