Inventor
DANNO TADATOSHI
JP52 patents
⚠️ This page may combine multiple inventors who share the name “DANNO TADATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
28 patentsUS8053875B2Nov 8, 2011
Method of manufacturing a semiconductor device
RENESAS ELECTRONICS CORP11 citations92
US7911054B2Mar 22, 2011
Semiconductor device
RENESAS ELECTRONICS CORP12 citations92
US7919858B2Apr 5, 2011
Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed
RENESAS ELECTRONICS CORP11 citations84
US8044509B2Oct 25, 2011
Semiconductor device
RENESAS ELECTRONICS CORP4 citations74
US10522446B2Dec 31, 2019
Semiconductor device and manufacturing method of the same
RENESAS ELECTRONICS CORP2 citations73
US10115658B2Oct 30, 2018
Semiconductor device
RENESAS ELECTRONICS CORP2 citations73
US10032736B2Jul 24, 2018
Semiconductor device
RENESAS ELECTRONICS CORP2 citations73
US9735127B2Aug 15, 2017
Semiconductor device and electronic device
RENESAS ELECTRONICS CORP3 citations73
US9024419B2May 5, 2015
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP3 citations73
US7833833B2Nov 16, 2010
Method of manufacturing a semiconductor device
RENESAS ELECTRONICS CORP5 citations73
US9806035B2Oct 31, 2017
Semiconductor device
RENESAS ELECTRONICS CORP2 citations72
US9196731B2Nov 24, 2015
Semiconductor device
RENESAS ELECTRONICS CORP6 citations69
US9496204B2Nov 15, 2016
Semiconductor device
RENESAS ELECTRONICS CORP2 citations63
US7998796B2Aug 16, 2011
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP2 citations63
US7937105B2May 3, 2011
Semiconductor device and electronic device
RENESAS ELECTRONICS CORP3 citations63
US10998288B2May 4, 2021
Method of manufacturing a semiconductor device
RENESAS ELECTRONICS CORP0 citations62
US10347567B2Jul 9, 2019
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations62
US9425165B2Aug 23, 2016
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations62
US7982301B2Jul 19, 2011
Semiconductor device
RENESAS ELECTRONICS CORP2 citations60
US10490486B2Nov 26, 2019
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US10157878B2Dec 18, 2018
Semiconductor device and electronic device
RENESAS ELECTRONICS CORP0 citations52
US8981538B2Mar 17, 2015
Semiconductor device and a method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP1 citations52
US10249595B2Apr 2, 2019
Method of manufacturing a semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US10083898B2Sep 25, 2018
Manufacturing method of semiconductor device and semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US10037932B2Jul 31, 2018
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations51
US9837339B2Dec 5, 2017
Manufacturing method of semiconductor device and semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US9252088B2Feb 2, 2016
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations51
US10643930B2May 5, 2020
Semiconductor device with semiconductor chips of different sizes and manufacturing method threreof
RENESAS ELECTRONICS CORP0 citations42
RENESAS TECH CORP
12 patentsUS7777309B2Aug 17, 2010
Amplifier chip mounted on a lead frame
RENESAS TECH CORP14 citations93
US7425756B2Sep 16, 2008
Semiconductor device and electronic device
RENESAS TECH CORP17 citations93
US7518156B2Apr 14, 2009
Semiconductor device
RENESAS TECH CORP22 citations92
US7282396B2Oct 16, 2007
Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
RENESAS TECH CORP10 citations92
US7312511B2Dec 25, 2007
Semiconductor device with electrically isolated ground structures
RENESAS TECH CORP12 citations84
US7285444B2Oct 23, 2007
Method of manufacturing semiconductor device
RENESAS TECH CORP10 citations84
US7709937B2May 4, 2010
Method of manufacturing semiconductor device
RENESAS TECH CORP6 citations74
US6838315B2Jan 4, 2005
Semiconductor device manufacturing method wherein electrode members are exposed from a mounting surface of a resin encapsulator
RENESAS TECH CORP9 citations73
US7220607B2May 22, 2007
Method of manufacturing a semiconductor device
RENESAS TECH CORP4 citations63
US7691677B2Apr 6, 2010
Method of manufacturing a semiconductor device
RENESAS TECH CORP2 citations62
US7608922B2Oct 27, 2009
Semiconductor device including amplifier and frequency converter
RENESAS TECH CORP3 citations60
US7732910B2Jun 8, 2010
Lead frame including suspending leads having trenches formed therein
RENESAS TECH CORP0 citations52
DANNO TADATOSHI
6 patentsUS8592961B2Nov 26, 2013
Method of manufacturing a semiconductor device
DANNO TADATOSHI5 citations83
US8513785B2Aug 20, 2013
Method of manufacturing a semiconductor device
DANNO TADATOSHI5 citations83
US8126501B2Feb 28, 2012
Semiconductor device and electronic device
DANNO TADATOSHI3 citations62
US8120174B2Feb 21, 2012
Semiconductor device and manufacturing method thereof
DANNO TADATOSHI1 citations62
US8471379B2Jun 25, 2013
Semiconductor device
DANNO TADATOSHI1 citations59
US8115295B2Feb 14, 2012
Semiconductor device
DANNO TADATOSHI1 citations59
HASEBE HAJIME
2 patentsHITACHI LTD
1 patentTAKADA KEITA
1 patentShowing the top 50 of 52 patents by PatentIndex Score.