P

Inventor

BROSS ARTHUR

US18 patents

Patents

18 patents
US5251806AOct 12, 1993

Method of forming dual height solder interconnections

IBM144 citations98
US5225777AJul 6, 1993

High density probe

IBM113 citations98
US5130779AJul 14, 1992

Solder mass having conductive encapsulating arrangement

IBM185 citations98
US5517751AMay 21, 1996

Multilayer microelectronic wiring module and method for forming the same

IBM50 citations96
US5410807AMay 2, 1995

High density electronic connector and method of assembly

IBM90 citations96
US5259110ANov 9, 1993

Method for forming a multilayer microelectronic wiring module

IBM65 citations96
US5324205AJun 28, 1994

Array of pinless connectors and a carrier therefor

IBM124 citations95
US5276964AJan 11, 1994

Method of manufacturing a high density connector system

IBM70 citations95
US5401911AMar 28, 1995

Via and pad structure for thermoplastic substrates and method and apparatus for forming the same

IBM30 citations90
US5305523AApr 26, 1994

Method of direct transferring of electrically conductive elements into a substrate

IBM25 citations90
US5303862AApr 19, 1994

Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures

IBM24 citations89
US5338208AAug 16, 1994

High density electronic connector and method of assembly

IBM17 citations82
US5244378ASep 14, 1993

Apparatus for dynamic gating of polymers for producing molded articles with isotropic properties

IBM14 citations73
US5205738AApr 27, 1993

High density connector system

IBM14 citations72
US5362360ANov 8, 1994

Method and product for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces

IBM3 citations63
US5399305AMar 21, 1995

Dynamic gating of polymers for isotropic properties

IBM4 citations62
US5312238AMay 17, 1994

Apparatus for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces

IBM1 citations52
US5326245AJul 5, 1994

Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process

IBM1 citations51