Inventor

KOOPMAN NICHOLAS G

US17 patents

⚠️ This page may combine multiple inventors who share the name “KOOPMAN NICHOLAS G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOOPMAN NICHOLAS G

MCNC

Method for testing, burn-in, and/or programming of integrated circuit chips

Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon

Method of forming differing volume solder bumps

Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon

Variable size capture pads for multilayer ceramic substrates and connectors therefor

Tacking processes and systems for soldering

Fluxless soldering sample pretreating system

Fluxless soldering of copper

Electrical connector including variably spaced connector contacts

IBM

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding

Palladium enhanced fluxless soldering and bonding of semiconductor device contacts

Solder mound formation on substrates

Palladium enhanced soldering and bonding of semiconductor device contacts

Process for in-situ modification of solder comopsition

Process of brazing using low temperature braze alloy of gold-indium tin