Inventor
TOTTA PAUL A
US16 patents
Patents
16 patentsUS5503286AApr 2, 1996
Electroplated solder terminal
IBM131 citations99
US5629564AMay 13, 1997
Electroplated solder terminal
IBM111 citations98
US5251806AOct 12, 1993
Method of forming dual height solder interconnections
IBM144 citations98
US5130779AJul 14, 1992
Solder mass having conductive encapsulating arrangement
IBM185 citations98
US5565707AOct 15, 1996
Interconnect structure using a Al2 Cu for an integrated circuit chip
IBM54 citations96
US5071714ADec 10, 1991
Multilayered intermetallic connection for semiconductor devices
IBM104 citations96
US5171642ADec 15, 1992
Multilayered intermetallic connection for semiconductor devices
IBM33 citations92
US5008730AApr 16, 1991
Contact stud structure for semiconductor devices
IBM41 citations92
US5008216AApr 16, 1991
Process for improved contact stud structure for semiconductor devices
IBM39 citations92
US4272561AJun 9, 1981
Hybrid process for SBD metallurgies
IBM34 citations92
US6255208B1Jul 3, 2001
Selective wafer-level testing and burn-in
IBM10 citations72
US5956573ASep 21, 1999
Use of argon sputtering to modify surface properties by thin film deposition
IBM11 citations71
US4824009AApr 25, 1989
Process for braze attachment of electronic package members
IBM11 citations71
US4839715AJun 13, 1989
Chip contacts without oxide discontinuities
IBM13 citations70
US4583488AApr 22, 1986
Variable axis rotary drive vacuum deposition system
IBM10 citations66
US6068923AMay 30, 2000
Use of argon sputtering to modify surface properties by thin film deposition
IBM1 citations49