Inventor
WIRSING ADOLF E
US8 patents
Patents
8 patentsUS5251806AOct 12, 1993
Method of forming dual height solder interconnections
IBM144 citations98
US5130779AJul 14, 1992
Solder mass having conductive encapsulating arrangement
IBM185 citations98
US5457345AOct 10, 1995
Metallization composite having nickle intermediate/interface
IBM56 citations94
US5104695AApr 14, 1992
Method and apparatus for vapor deposition of material onto a substrate
IBM54 citations94
US6706621B2Mar 16, 2004
Wafer integrated rigid support ring
IBM29 citations88
US7288492B2Oct 30, 2007
Method for forming interconnects on thin wafers
IBM7 citations70
US6951775B2Oct 4, 2005
Method for forming interconnects on thin wafers
IBM2 citations59
US7138326B2Nov 21, 2006
Wafer integrated rigid support ring
IBM3 citations58