Inventor
KING JERROLD L
US77 patents
Patents
50 patentsUS6429528B1Aug 6, 2002
Multichip semiconductor package
MICRON TECHNOLOGY INC194 citations99
US6258623B1Jul 10, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC354 citations99
US6225689B1May 1, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC295 citations99
US6198172B1Mar 6, 2001
Semiconductor chip package
MICRON TECHNOLOGY INC203 citations99
US6066514AMay 23, 2000
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC113 citations99
US5879965AMar 9, 1999
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
MICRON TECHNOLOGY INC173 citations99
US5677566AOct 14, 1997
Semiconductor chip package
MICRON TECHNOLOGY INC550 citations99
US5214845AJun 1, 1993
Method for producing high speed integrated circuits
MICRON TECHNOLOGY INC407 citations99
US5140404AAug 18, 1992
Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC208 citations99
US6246108B1Jun 12, 2001
Integrated circuit package including lead frame with electrically isolated alignment feature
MICRON TECHNOLOGY INC273 citations98
US6048744AApr 11, 2000
Integrated circuit package alignment feature
MICRON TECHNOLOGY INC275 citations98
US5140405AAug 18, 1992
Semiconductor assembly utilizing elastomeric single axis conductive interconnect
MICRON TECHNOLOGY INC181 citations98
US5440241AAug 8, 1995
Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby
MICRON TECHNOLOGY INC118 citations97
US5286679AFeb 15, 1994
Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
MICRON TECHNOLOGY INC331 citations97
US6686655B2Feb 3, 2004
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC45 citations96
US6656767B1Dec 2, 2003
Method of forming a stack of packaged memory dice
MICRON TECHNOLOGY INC41 citations96
US6531339B2Mar 11, 2003
Redundancy mapping in a multichip semiconductor package
MICRON TECHNOLOGY INC62 citations96
US6486546B2Nov 26, 2002
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC47 citations96
US6445063B1Sep 3, 2002
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC24 citations96
US6410859B1Jun 25, 2002
Electrical assembly for semiconductor dice
MICRON TECHNOLOGY INC56 citations96
US6323543B1Nov 27, 2001
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
MICRON TECHNOLOGY INC34 citations96
US6207474B1Mar 27, 2001
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC56 citations96
US6153929ANov 28, 2000
Low profile multi-IC package connector
MICRON TECHNOLOGY INC46 citations96
US6091136AJul 18, 2000
Plastic lead frames for semiconductor devices
MICRON TECHNOLOGY INC49 citations96
US5892660AApr 6, 1999
Single in line memory module adapter
MICRON TECHNOLOGY INC45 citations96
US5661901ASep 2, 1997
Method for mounting and electrically interconnecting semiconductor dice
MICRON TECHNOLOGY INC91 citations96
US5616953AApr 1, 1997
Lead frame surface finish enhancement
MICRON TECHNOLOGY INC88 citations96
US5177032AJan 5, 1993
Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC105 citations96
US6897553B2May 24, 2005
Apparatus for forming a stack of packaged memory dice
MICRON TECHNOLOGY INC16 citations93
US6781848B2Aug 24, 2004
Single-piece molded module housing
MICRON TECHNOLOGY INC13 citations93
US6773955B2Aug 10, 2004
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC19 citations93
US6475831B2Nov 5, 2002
Methods for a low profile multi-IC chip package connector
MICRON TECHNOLOGY INC14 citations93
US6465275B2Oct 15, 2002
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC16 citations93
US6438045B1Aug 20, 2002
Redundancy mapping in a multichip semiconductor package
MICRON TECHNOLOGY INC35 citations93
US6420195B1Jul 16, 2002
Method of aligning and testing a semiconductor chip package
MICRON TECHNOLOGY INC14 citations93
US6329221B1Dec 11, 2001
Method of forming a stack of packaged memory die and resulting apparatus
MICRON TECHNOLOGY INC15 citations93
US6316824B1Nov 13, 2001
Plastic leads frames for semiconductor devices
MICRON TECHNOLOGY INC18 citations93
US6294410B1Sep 25, 2001
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
MICRON TECHNOLOGY INC19 citations93
US6246615B1Jun 12, 2001
Redundancy mapping in a multichip semiconductor package
MICRON TECHNOLOGY INC29 citations93
US6232213B1May 15, 2001
Method of making a semiconductor chip package
MICRON TECHNOLOGY INC20 citations93
US6233154B1May 15, 2001
Single-piece molded module housing
MICRON TECHNOLOGY INC19 citations93
US6124151ASep 26, 2000
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
MICRON TECHNOLOGY INC19 citations93
US6063650AMay 16, 2000
Reduced stress LOC assembly
MICRON TECHNOLOGY INC26 citations93
US6008073ADec 28, 1999
Method of manufacturing a bus bar structure on lead frame of semiconductor device package
MICRON TECHNOLOGY INC36 citations93
US5914529AJun 22, 1999
Bus bar structure on lead frame of semiconductor device package
MICRON TECHNOLOGY INC26 citations93
US5872398AFeb 16, 1999
Reduced stress LOC assembly including cantilevered leads
MICRON TECHNOLOGY INC25 citations93
US6836003B2Dec 28, 2004
Integrated circuit package alignment feature
MICRON TECHNOLOGY INC17 citations92
US5583372ADec 10, 1996
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC37 citations92
US7091061B2Aug 15, 2006
Method of forming a stack of packaged memory dice
MICRON TECHNOLOGY INC10 citations82
US6724073B2Apr 20, 2004
Plastic lead frames for semiconductor devices and packages including same
MICRON TECHNOLOGY INC10 citations82
Showing the top 50 of 77 patents by PatentIndex Score.