Inventor

MOU JONG-I

TW54 patents

⚠️ This page may combine multiple inventors who share the name “MOU JONG-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOU JONG-I

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of test probe alignment control

Multi-zone temperature control for semiconductor wafer

Scanner overlay correction system and method

Systems and associated methods for tuning processing tools

Overlay abnormality gating by Z data

Apparatus and method for chemical mechanical polishing process control

System and method for controlling ion implanter

Detection of defects on wafer during semiconductor fabrication

Multi-zone temperature control for semiconductor wafer

Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

Real-time calibration for wafer processing chamber lamp modules

2D/3D analysis for abnormal tools and stages diagnosis

Scanner overlay correction system and method

TAIWAN SEMICONDUCTOR MFG

Scanner overlay correction system and method

Method for bin-based control

Semiconductor processing dispatch control

Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

System and method for implementing multi-resolution advanced process control

E-chuck for automated clamped force adjustment and calibration

Adaptive and automatic determination of system parameters

System and method of dosage profile control

Method and system of monitoring E-beam overlay and providing advanced process control

TSAI PO-FENG

Adaptive and automatic determination of system parameters

Method and system for implementing virtual metrology in semiconductor fabrication

Integrated circuit manufacturing tool condition monitoring system and method

Processing exception handling

APC model extension using existing APC models

WU SUNNY

Semiconductor processing dispatch control

Physical failure analysis guiding methods

Semiconductor processing dispatch control

Device performance parmeter tuning method and system

TSEN ANDY

System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture

Method and system for tuning advanced process control parameters

System and method for implementing multi-resolution advanced process control

System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) with routing model

CHEN JUI-LONG

Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

Method of test probe alignment control

System and method for data mining and feature tracking for fab-wide prediction and control

HSU CHIH-WEI

Two-dimensional multi-products multi-tools advanced process control

Advanced process control for new tapeout product

Systems and methods of automatic boundary control for semiconductor processes

HUI KEUNG

System and method of dosage profile control

Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process

CHANG CHUN-LIN

Multi-zone temperature control for semiconductor wafer

LIN CHUN-HSIEN

Method for a bin ratio forecast at new tape out stage

HO CHIA-TONG

Qualitative fault detection and classification system for tool condition monitoring and associated methods

FEI WANG JO

Advanced process control with novel sampling policy

CHANG CHIH-TIEN

Real-time calibration for wafer processing chamber lamp modules

WANG JO FEI

E-chuck with automated clamped force adjustment and calibration

TSAI PO FENG

Method and system for tool condition monitoring based on a simulated inline measurement