Inventor
CHU MING HSIEN
TW4 patents
Patents
4 patentsUS11037898B2Jun 15, 2021
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations68
US11784152B2Oct 10, 2023
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations57
US11101237B2Aug 24, 2021
Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer
ADVANCED SEMICONDUCTOR ENG0 citations57
US10763234B2Sep 1, 2020
Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer
ADVANCED SEMICONDUCTOR ENG1 citations57