Inventor

TZENG YUAN-LIN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “TZENG YUAN-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

1 patent

US7019389B2Mar 28, 2006

Lead frame and semiconductor package with the same

SILICONWARE PRECISION INDUSTRIES CO LTD23 citations88

TZENG YUAN-LIN

1 patent

US8207620B2Jun 26, 2012

Flip-chip semiconductor package and chip carrier for preventing corner delamination

TZENG YUAN-LIN1 citations42