Inventor
XIONG CHEN
CN5 patents
⚠️ This page may combine multiple inventors who share the name “XIONG CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
4 patentsUS10340246B1Jul 2, 2019
Wire ball bonding in semiconductor devices
TEXAS INSTRUMENTS INC2 citations64
US12283559B2Apr 22, 2025
Copper wire bond on gold bump on semiconductor die bond pad
TEXAS INSTRUMENTS INC0 citations56
US11515275B2Nov 29, 2022
Copper wire bond on gold bump on semiconductor die bond pad
TEXAS INSTRUMENTS INC0 citations56
US10692835B2Jun 23, 2020
Ball bond attachment for a semiconductor die
TEXAS INSTRUMENTS INC1 citations53