Inventor

CHIANG CHIEN

US38 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIANG CHIEN

INTEL CORP

Reducing shunts in memories with phase-change material

Metal structure for a phase-change memory device

Metal structure for a phase-change memory device

Using selective deposition to form phase-change memory cells

Method to enhance performance of thermal resistor device

Method for forming multileves interconnections for semiconductor fabrication

Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections

Compositionally modified resistive electrode

Silicon-rich block copolymers to achieve unbalanced vias

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer

Silicon-rich block copolymers to achieve unbalanced vias

Interconnect structure with hard mask and low dielectric constant materials

Fabricating low K dielectric interconnect systems by using dummy structures to enhance process

Method for fabricating an interconnect structure with hard mask and low dielectric constant materials

Interconnect structure and method to achieve unlanded vias for low dielectric constant materials

Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby

Using selective deposition to form phase-change memory cells

Using selective deposition to form phase-change memory cells

In-plane on-chip decoupling capacitors and method for making same

Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics

Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics

Low-K Dielectric layer and method of making same

Unlanded via structure and method for making same

Method for forming air gaps for advanced interconnect systems

Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme

Method to enhance performance of thermal resistor device

In-plane on-chip decoupling capacitors and method for making same

Reducing shunts in memories with phase-change material

OVONYX INC

Reduced area intersection between electrode and programming element

Method to enhance performance of thermal resistor device

Compositionally modified resistive electrode

Forming phase change memories

Forming phase change memories

Forming phase change memories

Compositionally modified resistive electrode

WU TOM

Method of forming a damascene structure with integrated planar dielectric layers

NOVELLUS SYSTEMS INC

Method of forming a damascene structure with integrated planar dielectric layers