Inventor
PAN CHUANBIN
US18 patents
⚠️ This page may combine multiple inventors who share the name “PAN CHUANBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS6154366ANov 28, 2000
Structures and processes for fabricating moisture resistant chip-on-flex packages
INTEL CORP496 citations98
US6143647ANov 7, 2000
Silicon-rich block copolymers to achieve unbalanced vias
INTEL CORP93 citations98
US6051869AApr 18, 2000
Silicon-rich block copolymers to achieve unbalanced vias
INTEL CORP60 citations96
US5886410AMar 23, 1999
Interconnect structure with hard mask and low dielectric constant materials
INTEL CORP110 citations96
US6309956B1Oct 30, 2001
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process
INTEL CORP138 citations95
US6027995AFeb 22, 2000
Method for fabricating an interconnect structure with hard mask and low dielectric constant materials
INTEL CORP59 citations94
US5935868AAug 10, 1999
Interconnect structure and method to achieve unlanded vias for low dielectric constant materials
INTEL CORP69 citations94
US6037249AMar 14, 2000
Method for forming air gaps for advanced interconnect systems
INTEL CORP48 citations89
SANDISK 3D LLC
5 patentsUS7906392B2Mar 15, 2011
Pillar devices and methods of making thereof
SANDISK 3D LLC21 citations92
US7955981B2Jun 7, 2011
Method of making a two-terminal non-volatile memory pillar device with rounded corner
SANDISK 3D LLC15 citations84
US7723180B2May 25, 2010
Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same
SANDISK 3D LLC5 citations63
US8981331B2Mar 17, 2015
Memory cells having storage elements that share material layers with steering elements and methods of forming the same
SANDISK 3D LLC0 citations52
US8969845B2Mar 3, 2015
Memory cells having storage elements that share material layers with steering elements and methods of forming the same
SANDISK 3D LLC0 citations52