Inventor
STEGER ROBERT J
US33 patents
⚠️ This page may combine multiple inventors who share the name “STEGER ROBERT J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS6108189AAug 22, 2000
Electrostatic chuck having improved gas conduits
APPLIED MATERIALS INC255 citations99
US5788799AAug 4, 1998
Apparatus and method for cleaning of semiconductor process chamber surfaces
APPLIED MATERIALS INC305 citations99
US6721162B2Apr 13, 2004
Electrostatic chuck having composite dielectric layer and method of manufacture
APPLIED MATERIALS INC76 citations98
US6170428B1Jan 9, 2001
Symmetric tunable inductively coupled HDP-CVD reactor
APPLIED MATERIALS INC430 citations98
US5720818AFeb 24, 1998
Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
APPLIED MATERIALS INC150 citations98
US5522131AJun 4, 1996
Electrostatic chuck having a grooved surface
APPLIED MATERIALS INC120 citations98
US6414834B1Jul 2, 2002
Dielectric covered electrostatic chuck
APPLIED MATERIALS INC56 citations96
US5904776AMay 18, 1999
Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
APPLIED MATERIALS INC52 citations96
US5494523AFeb 27, 1996
Controlling plasma particulates by contouring the plasma sheath using materials of differing RF impedances
APPLIED MATERIALS INC53 citations96
US5085727AFeb 4, 1992
Plasma etch apparatus with conductive coating on inner metal surfaces of chamber to provide protection from chemical corrosion
APPLIED MATERIALS INC83 citations96
US5292399AMar 8, 1994
Plasma etching apparatus with conductive means for inhibiting arcing
APPLIED MATERIALS INC123 citations95
US5100502AMar 31, 1992
Semiconductor wafer transfer in processing systems
APPLIED MATERIALS INC89 citations94
US5356486AOct 18, 1994
Combined wafer support and temperature monitoring device
APPLIED MATERIALS INC46 citations93
US5308417AMay 3, 1994
Uniformity for magnetically enhanced plasma chambers
APPLIED MATERIALS INC63 citations93
US5715132AFeb 3, 1998
Method and structure for improving gas breakdown resistance and reducing the potential of arcing in an electrostatic chuck
APPLIED MATERIALS INC30 citations92
US5644467AJul 1, 1997
Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck
APPLIED MATERIALS INC30 citations92
US5268200ADec 7, 1993
Method of forming plasma etch apparatus with conductive coating on inner metal surfaces of chamber to provide protection from chemical corrosion
APPLIED MATERIALS INC28 citations92
US5567909AOct 22, 1996
Method for supporting a wafer in a combined wafer support and temperature monitoring device
APPLIED MATERIALS INC17 citations79
LAM RES CORP
14 patentsUS6896765B2May 24, 2005
Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
LAM RES CORP77 citations98
US6805952B2Oct 19, 2004
Low contamination plasma chamber components and methods for making the same
LAM RES CORP135 citations98
US6770852B1Aug 3, 2004
Critical dimension variation compensation across a wafer by means of local wafer temperature control
LAM RES CORP102 citations98
US7161121B1Jan 9, 2007
Electrostatic chuck having radial temperature control capability
LAM RES CORP53 citations96
US6632322B1Oct 14, 2003
Switched uniformity control
LAM RES CORP46 citations96
US7993460B2Aug 9, 2011
Substrate support having dynamic temperature control
LAM RES CORP26 citations92
US7718932B2May 18, 2010
Electrostatic chuck having radial temperature control capability
LAM RES CORP28 citations92
US7223321B1May 29, 2007
Faraday shield disposed within an inductively coupled plasma etching apparatus
LAM RES CORP40 citations92
US7176403B2Feb 13, 2007
Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
LAM RES CORP27 citations92
US6976782B1Dec 20, 2005
Methods and apparatus for in situ substrate temperature monitoring
LAM RES CORP15 citations84
US7648582B2Jan 19, 2010
Cleaning of electrostatic chucks using ultrasonic agitation and applied electric fields
LAM RES CORP7 citations74
US8921740B2Dec 30, 2014
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
LAM RES CORP3 citations63
US7480974B2Jan 27, 2009
Methods of making gas distribution members for plasma processing apparatuses
LAM RES CORP6 citations63
US7282454B2Oct 16, 2007
Switched uniformity control
LAM RES CORP3 citations63