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Inventor
CHANG THOON KHIN
MY
2 patents
Patents
2 patents
US7494924B2
Feb 24, 2009
Method for forming reinforced interconnects on a substrate
FREESCALE SEMICONDUCTOR INC
2 citations
58
US7566648B2
Jul 28, 2009
Method of making solder pad
FREESCALE SEMICONDUCTOR INC
1 citations
47