Inventor
MORIIZUMI KIYOKAZU
JP20 patents
⚠️ This page may combine multiple inventors who share the name “MORIIZUMI KIYOKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
19 patentsUS7222420B2May 29, 2007
Method for making a front and back conductive substrate
FUJITSU LTD107 citations97
US6410983B1Jun 25, 2002
Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip
FUJITSU LTD84 citations97
US7579553B2Aug 25, 2009
Front-and-back electrically conductive substrate
FUJITSU LTD50 citations96
US6399897B1Jun 4, 2002
Multi-layer wiring substrate
FUJITSU LTD63 citations95
US6485814B1Nov 26, 2002
High density thin film circuit board and method of production thereof
FUJITSU LTD35 citations92
US5608192AMar 4, 1997
Multilayer thin-film wiring board
FUJITSU LTD32 citations92
US4949219AAug 14, 1990
Module sealing structure
FUJITSU LTD27 citations92
US6054652AApr 25, 2000
Thin-film multi-layer substrate and electronic device
FUJITSU LTD31 citations91
US6526654B1Mar 4, 2003
Method of producing double-sided circuit board
FUJITSU LTD20 citations90
US6717262B1Apr 6, 2004
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
FUJITSU LTD14 citations84
US7298605B2Nov 20, 2007
Electrolytic capacitor
FUJITSU LTD10 citations82
US6618239B2Sep 9, 2003
Key switch and keyboard
FUJITSU LTD11 citations73
US5496971AMar 5, 1996
Circuit arrangement for multilayer printed circuit board
FUJITSU LTD7 citations73
US6303877B2Oct 16, 2001
Multilayer thin-film wiring board
FUJITSU LTD10 citations72
US6465085B1Oct 15, 2002
Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
FUJITSU LTD2 citations58
US10614189B2Apr 7, 2020
Component retrieve device and component retrieve method
FUJITSU LTD0 citations52
US9541602B2Jan 10, 2017
Electronic component inspection apparatus and method
FUJITSU LTD0 citations52
US7005318B2Feb 28, 2006
Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
FUJITSU LTD0 citations52
US9545044B2Jan 10, 2017
Electronic component assembly apparatus
FUJITSU LTD0 citations51