Inventor
KIKUCHI SHUNICHI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “KIKUCHI SHUNICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
22 patentsUS5894882AApr 20, 1999
Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure
FUJITSU LTD60 citations96
US5763950AJun 9, 1998
Semiconductor element cooling apparatus
FUJITSU LTD111 citations96
US6399897B1Jun 4, 2002
Multi-layer wiring substrate
FUJITSU LTD63 citations95
US5586006ADec 17, 1996
Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
FUJITSU LTD59 citations95
US5126919AJun 30, 1992
Cooling system for an electronic circuit device
FUJITSU LTD83 citations95
US4920574AApr 24, 1990
Cooling system for an electronic circuit device
FUJITSU LTD87 citations95
US4879632ANov 7, 1989
Cooling system for an electronic circuit device
FUJITSU LTD67 citations95
US4783721ANov 8, 1988
Cooling system for an electronic circuit device
FUJITSU LTD73 citations95
US6300678B1Oct 9, 2001
I/O pin having solder dam for connecting substrates
FUJITSU LTD56 citations94
US5050037ASep 17, 1991
Liquid-cooling module system for electronic circuit components
FUJITSU LTD76 citations94
US4712158ADec 8, 1987
Cooling system for electronic circuit components
FUJITSU LTD112 citations93
US6054652AApr 25, 2000
Thin-film multi-layer substrate and electronic device
FUJITSU LTD31 citations91
US7199718B2Apr 3, 2007
RFID tag with thermal conductive cover
FUJITSU LTD14 citations84
US10443957B2Oct 15, 2019
Cooling plate and information processing device
FUJITSU LTD7 citations83
US6303877B2Oct 16, 2001
Multilayer thin-film wiring board
FUJITSU LTD10 citations72
US9642287B2May 2, 2017
Cooling plate and data processing system provided with cooling plates
FUJITSU LTD3 citations71
US7951249B2May 31, 2011
RFID tag
FUJITSU LTD2 citations63
US6891247B2May 10, 2005
Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding
FUJITSU LTD6 citations62
US6465085B1Oct 15, 2002
Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same
FUJITSU LTD2 citations58
US7431218B2Oct 7, 2008
RFID tag, module component, and RFID tag fabrication method
FUJITSU LTD1 citations52
US6787711B2Sep 7, 2004
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
FUJITSU LTD0 citations50
US10108235B2Oct 23, 2018
Information processing apparatus and heat exchanger
FUJITSU LTD0 citations41