Inventor
CHEN SCOTT
TW6 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SCOTT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNICAP ELECTRONICS IND CORP
2 patentsUS6711812B1Mar 30, 2004
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
UNICAP ELECTRONICS IND CORP47 citations88
US6675472B1Jan 13, 2004
Process and structure for manufacturing plastic chip carrier
UNICAP ELECTRONICS IND CORP8 citations67