Inventor
HERRON LESTER WYNN
US16 patents
⚠️ This page may combine multiple inventors who share the name “HERRON LESTER WYNN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US6341417B1Jan 29, 2002
Pre-patterned substrate layers for being personalized as needed
IBM19 citations92
US5945735AAug 31, 1999
Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity
IBM21 citations92
US6124041ASep 26, 2000
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM35 citations89
US6037193AMar 14, 2000
Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity
IBM16 citations84
US5925443AJul 20, 1999
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM14 citations79
US6475555B2Nov 5, 2002
Process for screening features on an electronic substrate with a low viscosity paste
IBM7 citations73
US5763093AJun 9, 1998
Aluminum nitride body having graded metallurgy
IBM10 citations71
US5682589AOct 28, 1997
Aluminum nitride body having graded metallurgy
IBM9 citations71
US5932043AAug 3, 1999
Method for flat firing aluminum nitride/tungsten electronic modules
IBM12 citations68
US6358439B1Mar 19, 2002
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM1 citations60
US5888446AMar 30, 1999
Method of forming an aluminum nitride article utilizing a platinum catalyst
IBM5 citations60
US6272957B1Aug 14, 2001
Flex die punching apparatus and method
IBM2 citations59
US6116127ASep 12, 2000
Flex die punching apparatus and method
IBM1 citations59
US5974931ANov 2, 1999
Flex die punching apparatus and method
IBM0 citations48