Inventor
LONG DAVID CLIFFORD
US26 patents
⚠️ This page may combine multiple inventors who share the name “LONG DAVID CLIFFORD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
25 patentsUS5645673AJul 8, 1997
Lamination process for producing non-planar substrates
IBM31 citations90
US6975199B2Dec 13, 2005
Embedded inductor and method of making
IBM29 citations89
US6532654B2Mar 18, 2003
Method of forming an electrical connector
IBM38 citations89
US11493565B2Nov 8, 2022
Leakage characterization and management for electronic circuit enhancement
IBM2 citations72
US6017025AJan 25, 2000
Component retainer
IBM13 citations72
US5996985ADec 7, 1999
Component retainer
IBM10 citations72
US6931712B2Aug 23, 2005
Method of forming a dielectric substrate having a multiturn inductor
IBM10 citations71
US5905352AMay 18, 1999
Magneto-repulsion punching with dynamic damping
IBM9 citations71
US5846361ADec 8, 1998
Lamination process for producing non-planar substrates
IBM15 citations71
US5795217AAug 18, 1998
Stressed burnisher
IBM8 citations71
US5745238AApr 28, 1998
Apparatus and method for non-destructive inspection and/or measurement
IBM14 citations71
US5726568AMar 10, 1998
Magneto-repulsion punching with dynamic damping
IBM9 citations71
US5759669AJun 2, 1998
Apparatus and method for screening green sheet with via hole using porous backing material
IBM14 citations69
US12207392B2Jan 21, 2025
Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction
IBM0 citations62
US11822707B2Nov 21, 2023
Secure ventilation through protective flexible sensors
IBM0 citations62
US12535537B2Jan 27, 2026
Leakage characterization for electronic circuit temperature monitoring
IBM0 citations61
US11991277B2May 21, 2024
Cryptographic hardware security module with secure embedded heat pipe
IBM0 citations61
US11614497B2Mar 28, 2023
Leakage characterization for electronic circuit temperature monitoring
IBM0 citations61
US11382210B1Jul 5, 2022
Dielectric material change to optimize electrical and mechanical properties of flex circuit
IBM0 citations61
US6272957B1Aug 14, 2001
Flex die punching apparatus and method
IBM2 citations59
US6116127ASep 12, 2000
Flex die punching apparatus and method
IBM1 citations59
US5891543AApr 6, 1999
Apparatus and method for screening using electrostatic adhesion
IBM3 citations58
US12414229B2Sep 9, 2025
Tearing security feature of printed circuit substrates
IBM0 citations57
US11765816B2Sep 19, 2023
Tamper-respondent assemblies with pressure connector assemblies
IBM0 citations49
US5974931ANov 2, 1999
Flex die punching apparatus and method
IBM0 citations48