P

Inventor

ASHIZAWA TORANOSUKE

JP25 patents
⚠️ This page may combine multiple inventors who share the name “ASHIZAWA TORANOSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

21 patents
US6221118B1Apr 24, 2001

Cerium oxide abrasive and method of polishing substrates

HITACHI CHEMICAL CO LTD123 citations98
US6863700B2Mar 8, 2005

Cerium oxide abrasive and method of polishing substrates

HITACHI CHEMICAL CO LTD37 citations96
US6343976B1Feb 5, 2002

Abrasive, method of polishing wafer, and method of producing semiconductor device

HITACHI CHEMICAL CO LTD60 citations96
US6783434B1Aug 31, 2004

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

HITACHI CHEMICAL CO LTD61 citations94
US6615499B1Sep 9, 2003

Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device

HITACHI CHEMICAL CO LTD28 citations90
US8002860B2Aug 23, 2011

CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive

HITACHI CHEMICAL CO LTD12 citations81
US7410409B1Aug 12, 2008

Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound

HITACHI CHEMICAL CO LTD9 citations81
US4542110ASep 17, 1985

Process for producing zirconium oxide sintered body

HITACHI CHEMICAL CO LTD20 citations76
US7708788B2May 4, 2010

Cerium oxide abrasive and method of polishing substrates

HITACHI CHEMICAL CO LTD6 citations73
US7115021B2Oct 3, 2006

Abrasive, method of polishing target member and process for producing semiconductor device

HITACHI CHEMICAL CO LTD8 citations73
US6194826B1Feb 27, 2001

Process for preparing phosphor pattern, phosphor pattern prepared the same and back plate for plasma display panel

HITACHI CHEMICAL CO LTD13 citations73
US7163644B2Jan 16, 2007

CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate

HITACHI CHEMICAL CO LTD8 citations72
US6232024B1May 15, 2001

Fluorescent pattern, process for preparing the same, organic alkali developing solution for forming the same, emulsion developing solution for forming the same and back plate for plasma display using the same

HITACHI CHEMICAL CO LTD8 citations72
US5147851ASep 15, 1992

Superconducting thick film circuit board, production thereof, thick film superconductor and production thereof

HITACHI CHEMICAL CO LTD9 citations71
US7963825B2Jun 21, 2011

Abrasive, method of polishing target member and process for producing semiconductor device

HITACHI CHEMICAL CO LTD1 citations62
US7871308B2Jan 18, 2011

Abrasive, method of polishing target member and process for producing semiconductor device

HITACHI CHEMICAL CO LTD1 citations62
US6358663B2Mar 19, 2002

Fluorescent pattern, process for preparing the same, organic alkali developing solution for forming the same, emulsion developing solution for forming the same and back plate for plasma display using the same

HITACHI CHEMICAL CO LTD4 citations61
US5194421AMar 16, 1993

Bi-Pb-Sr-Mg-Ba-Ca-Cu-O oxide superconductors and production thereof

HITACHI CHEMICAL CO LTD3 citations60
US5238911AAug 24, 1993

Oxide superconductor Bi--Sr--Ca--Mg--Ba--Cu--O

HITACHI CHEMICAL CO LTD5 citations58
US7887609B2Feb 15, 2011

Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same

HITACHI CHEMICAL CO LTD1 citations52
US7867303B2Jan 11, 2011

Cerium oxide abrasive and method of polishing substrates

HITACHI CHEMICAL CO LTD0 citations52

YOSHIDA MASATO

3 patents

KOYAMA NAOYUKI

1 patent