P

Inventor

SANDHU SUKESH

US31 patents
⚠️ This page may combine multiple inventors who share the name “SANDHU SUKESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

29 patents
US7052972B2May 30, 2006

Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus

MICRON TECHNOLOGY INC217 citations99
US6323085B1Nov 27, 2001

High coupling split-gate transistor and method for its formation

MICRON TECHNOLOGY INC46 citations96
US7811935B2Oct 12, 2010

Isolation regions and their formation

MICRON TECHNOLOGY INC20 citations92
US7179717B2Feb 20, 2007

Methods of forming integrated circuit devices

MICRON TECHNOLOGY INC39 citations92
US6924186B2Aug 2, 2005

Method of forming a memory device and semiconductor device

MICRON TECHNOLOGY INC29 citations92
US6677640B1Jan 13, 2004

Memory cell with tight coupling

MICRON TECHNOLOGY INC28 citations92
US6614072B2Sep 2, 2003

High coupling split-gate transistor

MICRON TECHNOLOGY INC16 citations92
US7375004B2May 20, 2008

Method of making an isolation trench and resulting isolation trench

MICRON TECHNOLOGY INC12 citations84
US7271060B2Sep 18, 2007

Semiconductor processing methods

MICRON TECHNOLOGY INC10 citations84
US6830975B2Dec 14, 2004

Method of forming field effect transistor comprising at least one of a conductive metal or metal compound in electrical connection with transistor gate semiconductor material

MICRON TECHNOLOGY INC12 citations81
US7999328B2Aug 16, 2011

Isolation trench having first and second trench areas of different widths

MICRON TECHNOLOGY INC5 citations74
US7396720B2Jul 8, 2008

High coupling memory cell

MICRON TECHNOLOGY INC7 citations74
US6750502B1Jun 15, 2004

Technique to quench electrical defects in aluminum oxide film

MICRON TECHNOLOGY INC5 citations74
US6398923B1Jun 4, 2002

Multiple species sputtering method

MICRON TECHNOLOGY INC7 citations72
US5750012AMay 12, 1998

Multiple species sputtering for improved bottom coverage and improved sputter rate

MICRON TECHNOLOGY INC13 citations72
US8963279B2Feb 24, 2015

Semiconductor device isolation structures

MICRON TECHNOLOGY INC3 citations63
US7935610B2May 3, 2011

Semiconductor device isolation structures

MICRON TECHNOLOGY INC2 citations63
US7781860B2Aug 24, 2010

Semiconductor constructions, and electronic systems

MICRON TECHNOLOGY INC2 citations63
US7473615B2Jan 6, 2009

Semiconductor processing methods

MICRON TECHNOLOGY INC4 citations63
US7413962B2Aug 19, 2008

Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus

MICRON TECHNOLOGY INC3 citations63
US6083358AJul 4, 2000

Multiple species sputtering for improved bottom coverage and improved sputter rate

MICRON TECHNOLOGY INC1 citations61
US8378446B2Feb 19, 2013

Semiconductor device isolation structures

MICRON TECHNOLOGY INC0 citations52
US8035189B2Oct 11, 2011

Semiconductor constructions

MICRON TECHNOLOGY INC0 citations52
US7749837B2Jul 6, 2010

High coupling memory cell

MICRON TECHNOLOGY INC0 citations52
US7453134B2Nov 18, 2008

Integrated circuit device with a circuit element formed on an active region having rounded corners

MICRON TECHNOLOGY INC0 citations52
US7241661B2Jul 10, 2007

Method of forming a coupling dielectric Ta2O5 in a memory device

MICRON TECHNOLOGY INC0 citations52
US7358139B2Apr 15, 2008

Method of forming a field effect transistor including depositing and removing insulative material effective to expose transistor gate conductive material but not transistor gate semiconductor material

MICRON TECHNOLOGY INC0 citations51
US7271064B2Sep 18, 2007

Method of forming a field effect transistor using conductive masking material

MICRON TECHNOLOGY INC0 citations51
US7112491B2Sep 26, 2006

Methods of forming field effect transistors including floating gate field effect transistors

MICRON TECHNOLOGY INC0 citations51

SANDHU SUKESH

1 patent

RUDECK PAUL J

1 patent