Inventor

KUROSAWA SHIN

JP2 patents

Patents

2 patents

US6491508B1Dec 10, 2002

Molding die set

OKI ELECTRIC IND CO LTD14 citations78

US6756690B2Jun 29, 2004

Molding die set and semiconductor device fabricated using the same

OKI ELECTRIC IND CO LTD0 citations46